1SG110HN2F43E2VG

The 1SG110HN2F43E2VG is an Intel Stratix® 10 GX Field Programmable Gate Array (FPGA) in a 1760-BBGA FCBGA package designed for high-performance, bandwidth‑intensive applications. Built on the Stratix® 10 family architecture, it targets systems that require large programmable logic capacity, plentiful I/O and significant embedded RAM for complex custom hardware acceleration and signal processing tasks.

This device pairs a high logic element count and substantial on-chip memory with a low-voltage core supply range and extended-grade operating conditions, making it suitable for demanding compute, networking and communications designs where integration and scalability matter.

Key Features

• Core Architecture  Leveraging the Stratix® 10 GX family architecture as described in the device overview, including Intel Hyperflex core innovations used across the series.
• Logic Capacity  1,100,000 logic elements providing large programmable fabric to implement complex state machines, pipelines and custom accelerators.
• Embedded Memory  112,197,632 total RAM bits of on-chip memory to support large buffers, packet queues and scratchpad storage for compute and networking functions.
• I/O  688 I/O pins to support wide parallel interfaces, multiple high-speed links and rich peripheral connectivity.
• Package & Mounting  1760-BBGA (FCBGA) package; supplier device package listed as 1760-FBGA (42.5 × 42.5) and designed for surface-mount assembly.
• Power / Core Supply  Core voltage supply range of 770 mV to 970 mV for low-voltage operation consistent with high-density FPGA fabric.
• Operating Range & Grade  Extended grade device specified for operation from 0 °C to 100 °C.
• Environmental Compliance  RoHS compliant.

Typical Applications

• High‑Performance Networking  Use the device’s high logic density, large embedded RAM and ample I/O to implement packet processing, line-rate switching, and protocol offload engines.
• Data Center Acceleration  Implement custom accelerators and hardware offloads for encryption, compression, and search workloads that benefit from large logic fabric and on-chip memory.
• Telecommunications Infrastructure  Deploy in systems that require high I/O counts and significant programmable resources for PHY, MAC and forward error correction functions.
• Signal Processing & DSP  Leverage the on-chip memory and logic capacity for real-time signal processing pipelines, filtering and algorithmic acceleration.

Unique Advantages

• Large Programmable Fabric: 1,100,000 logic elements enable implementation of very large, complex designs on a single device, reducing system BOM.
• Substantial On‑Chip Memory: 112,197,632 total RAM bits provide large buffer and state storage for data‑intensive algorithms without immediate external memory dependence.
• High I/O Count: 688 I/Os allow flexible interfacing to multiple parallel buses, peripherals and transceiver channels for dense system integration.
• Compact High‑Pin Package: 1760-BBGA FCBGA (42.5 × 42.5 mm supplier package) supports high I/O density in a surface-mount form factor for modern PCB layouts.
• Low‑Voltage Core Operation: 770 mV–970 mV core supply supports the device’s high-density fabric while enabling power-optimized designs.
• Extended Grade & Compliance: Extended grade rating with 0 °C to 100 °C operating range and RoHS compliance for regulated assemblies.

Why Choose 1SG110HN2F43E2VG?

The 1SG110HN2F43E2VG combines a high logic element count and significant embedded RAM with a broad I/O complement and a compact high-pin-count package, making it a practical choice for demanding applications in networking, data center acceleration and telecommunications. Its Stratix® 10 GX family heritage and series-level architectural innovations position the device for designs that need high integration and the ability to scale functionality on a single programmable platform.

For engineering teams designing hardware accelerators, packet processors or complex signal-processing engines, this FPGA delivers the resources needed to consolidate functions, reduce system-level complexity and accelerate time to market while aligning with common manufacturing and compliance requirements.

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