1SG110HN1F43I2LGAS

IC FPGA 688 I/O 1760FBGA
Part Description

Stratix® 10 GX Field Programmable Gate Array (FPGA) IC 688 1100000 1760-BBGA, FCBGA

Quantity 542 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package1760-FBGA (42.5x42.5)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1760-BBGA, FCBGANumber of I/O688Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs137500Number of Logic Elements/Cells1100000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits112197632

Overview of 1SG110HN1F43I2LGAS – Stratix® 10 GX FPGA, 1,100,000 logic elements, 688 I/O, 1760-BBGA

The Intel Stratix® 10 GX device 1SG110HN1F43I2LGAS is a high-capacity field programmable gate array (FPGA) designed for performance‑ and bandwidth‑focused systems. The device combines the Stratix 10 family’s core innovations—including the Intel Hyperflex™ core architecture and Intel 14 nm tri‑gate (FinFET) technology—with device‑level resources to address advanced networking, compute acceleration, and high‑speed I/O applications.

This industrial‑grade, surface‑mount FPGA offers 1,100,000 logic elements, 688 user I/O pins, and 112,197,632 bits of on‑chip RAM, making it suitable for designs that require dense logic, substantial embedded memory, and extensive I/O connectivity while operating across a wide industrial temperature range.

Key Features

  • Core & architecture (family): Built on the Intel Stratix 10 GX family featuring the Intel Hyperflex™ core architecture and Intel 14 nm tri‑gate (FinFET) technology for family‑level performance and power improvements.
  • Logic resources: 1,100,000 logic elements to implement complex, high‑density logic and control functions.
  • Embedded memory: 112,197,632 total RAM bits of on‑chip memory for buffering, packet processing, and large state storage.
  • I/O density: 688 user I/O pins enabling broad external interfacing and connectivity for multi‑lane links and parallel interfaces.
  • Package & mounting: 1760‑BBGA (FCBGA) supplier package: 1760‑FBGA with a 42.5 × 42.5 mm footprint; surface‑mount package suitable for compact board designs.
  • Power supply range: Core voltage supply specified from 820 mV to 880 mV for core power domain planning.
  • Operating temperature: Industrial temperature range from −40°C to 100°C for deployment in demanding environments.
  • Industry compliance: RoHS compliant.
  • Family high‑speed features (from device family): Stratix 10 GX family supports advanced transceiver and interface capabilities, hard PCIe and Ethernet IP, and high‑precision DSP and PLL features as documented for the family.

Typical Applications

  • High‑performance networking and telecom: Implement packet processing, switching, and multi‑lane backplane interfaces using the device’s high I/O count and large on‑chip memory.
  • Data center acceleration: Use the FPGA’s dense logic and memory resources for hardware acceleration tasks such as custom packet processing or workload offload.
  • High‑speed test and measurement: Integrate wide parallel data capture and protocol processing leveraging abundant I/O and logic capacity.
  • Signal processing and DSP: Deploy algorithm acceleration and real‑time signal chains that require significant on‑chip RAM and logic resources.

Unique Advantages

  • High logic capacity: 1,100,000 logic elements allow implementation of complex, high‑density custom logic and large state machines on a single device.
  • Substantial on‑chip RAM: 112,197,632 bits of embedded RAM reduce dependency on external memory for many buffering and storage tasks.
  • Broad I/O availability: 688 I/O pins provide flexibility for multi‑lane links, parallel interfaces, and mixed I/O requirements.
  • Industrial operating range: Rated for −40°C to 100°C operation to support deployments in industrial and harsh environments.
  • Compact, high‑pin package: 1760‑FBGA (42.5 × 42.5 mm) package supports high I/O density in a compact footprint for board‑level integration.
  • RoHS compliant: Meets environmental material requirements for regulated product development.

Why Choose 1SG110HN1F43I2LGAS?

The 1SG110HN1F43I2LGAS brings together device‑level resources—1,100,000 logic elements, 112,197,632 bits of embedded RAM, and 688 I/O pins—in a robust industrial‑grade Stratix 10 GX package. It is well suited to engineers and system designers who need a single FPGA platform capable of handling dense logic, significant on‑chip memory, and extensive external connectivity while leveraging the Stratix 10 family innovations documented for core performance and high‑speed interfaces.

Choose this device when your design requires high resource density, flexible I/O, and industrial temperature operation combined with the Stratix 10 family feature set for advanced transceiver, DSP, and system integration options.

Request a quote or submit an inquiry to discuss pricing, availability, and technical support for 1SG110HN1F43I2LGAS.

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