1SG110HN1F43I1VG

The 1SG110HN1F43I1VG is an Intel Stratix® 10 GX field programmable gate array (FPGA) optimized for high-bandwidth, high-performance applications. Built on the Stratix 10 family architecture, the device leverages Intel Hyperflex core architecture and Intel 14 nm tri-gate (FinFET) technology to address compute- and I/O-intensive designs.

This part delivers large programmable capacity, extensive on-chip RAM and a high I/O count in a 1760-package, making it suitable for industrial applications that require dense logic, serious memory resources and robust thermal range.

Key Features

• Core architecture  Intel Hyperflex core architecture and Intel 14 nm tri-gate (FinFET) technology as described for the Stratix 10 family.
• Logic capacity  1,100,000 logic elements for complex custom logic and high-density implementations.
• On-chip memory  112,197,632 total RAM bits to support large buffering, LUT-based storage and accelerator designs.
• I/O and package  688 I/O pins in a 1760-BBGA, FCBGA package; supplier device package specified as 1760-FBGA (42.5x42.5).
• Operating range and mounting  Industrial grade device with operating temperature from -40°C to 100°C and surface-mount package.
• Core supply voltage  Low-voltage core supply range: 770 mV to 970 mV for optimized core power delivery.
• Family-level high-speed I/O and IP  Stratix 10 family features include heterogeneous 3D SiP transceiver tiles, high-speed transceiver capability and hard IP blocks for high-performance serial protocols (family-level details from the device overview).
• Standards compliance  RoHS compliant.

Typical Applications

• High-performance networking and telecommunications  Large logic capacity, extensive RAM and high I/O count support packet processing, switch fabric and line-rate protocol implementations.
• Data-center acceleration and compute  High logic density and significant on-chip memory enable hardware accelerators, compression engines and custom compute offloads.
• High-speed serial and backplane interfaces  Stratix 10 family transceiver and hard-IP features support high-throughput chip-to-chip and backplane connectivity (family-level capability).
• Embedded processing and SoC integration  Family-level embedded processing options and hard IP allow integration of processor subsystems with programmable fabric for complex system designs.

Unique Advantages

• High programmable density: 1,100,000 logic elements provide the headroom for deep pipelines, wide datapaths and complex state machines.
• Substantial on-chip RAM: 112,197,632 total RAM bits reduce dependence on external memory for many buffering and caching tasks.
• Extensive I/O in a compact package: 688 I/Os in a 1760-FBGA footprint simplify layouts that require many high-speed interfaces while preserving board space.
• Industrial temperature rating: Specified -40°C to 100°C operation supports deployments in demanding environments.
• Low-voltage core operation: 770 mV to 970 mV supply range supports efficient power delivery strategies for advanced FPGA systems.
• Family-level ecosystem and IP: Stratix 10 family innovations (Hyperflex architecture, transceiver and protocol IP) provide a coherent development platform for high-performance designs.

Why Choose 1SG110HN1F43I1VG?

This Stratix 10 GX FPGA balances large programmable capacity, significant on-chip memory and substantial I/O in a 1760‑FBGA package, all within an industrial temperature envelope. The device is aimed at systems that require high logic density, robust memory resources and the ability to support many high-speed interfaces.

Designers targeting advanced networking, compute acceleration or embedded systems integration will find this part well-suited for scalable, high-performance implementations that leverage the Stratix 10 family-level architecture and IP.

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