1SG110HN1F43E2LG

The 1SG110HN1F43E2LG is an Intel Stratix® 10 GX field programmable gate array (FPGA) packaged in a 1760-BBGA (1760-FBGA, 42.5 × 42.5 mm) surface-mount package. It delivers a very high logic capacity and large on-chip RAM to support advanced, bandwidth- and compute-intensive applications.

As a member of the Stratix 10 GX family, this device leverages the family-level innovations described in the official device overview, including the Intel Hyperflex™ core architecture and other high-performance features aimed at meeting demanding processing and bandwidth requirements.

Key Features

• Logic Capacity  1,100,000 logic elements (cells) provide significant programmable fabric for complex designs and large-scale digital processing.
• Embedded Memory  112,197,632 total RAM bits on-chip to support large buffers, on-chip storage and memory-hungry algorithms.
• High I/O Count  688 I/O pins to support dense external connectivity and multi-channel interfaces.
• Package and Mounting  1760-BBGA (FCBGA) surface-mount package; supplier device package listed as 1760-FBGA (42.5 × 42.5 mm) for compact, high-density board integration.
• Power Supply  Core voltage supply range specified at 820 mV to 880 mV, enabling designs that target the device’s specified operating conditions.
• Operating Range  Extended-grade device with an operating temperature range of 0 °C to 100 °C to meet a variety of system thermal environments.
• Regulatory Compliance  RoHS compliant.
• Family-Level Innovations  Part of the Stratix 10 GX family, which includes the Intel Hyperflex core architecture and other high-performance features outlined in the device overview.

Typical Applications

• High-Performance Networking  Dense logic and high I/O count support packet processing, switch/router logic and multi-lane network interfaces.
• Compute-Intensive Acceleration  Large on-chip RAM and extensive logic resources enable hardware acceleration for data-center and edge compute workloads.
• Advanced Signal Processing  High logic capacity and memory resources suit DSP, filtering and real-time data-path implementations.
• System Integration and Prototyping  High-density I/O and large fabric make the device suitable for complex system prototypes and integrated FPGA-based subsystems.

Unique Advantages

• Substantial Logic Resources: 1,100,000 logic elements provide the headroom needed for large designs and complex IP integration without fragmenting the design across multiple devices.
• Large On-Chip Memory: 112,197,632 total RAM bits reduce reliance on external memory for many buffering and storage needs, simplifying board-level memory architecture.
• High-Density I/O: 688 I/Os help consolidate multi-channel interfaces and reduce the need for external multiplexing or additional interface chips.
• Compact, High-Pin Package: 1760-BBGA footprint (42.5 × 42.5 mm) enables dense system layouts while delivering extensive I/O and routing capability.
• Extended Grade Operating Range: Rated 0 °C to 100 °C to accommodate a range of system thermal environments where extended-grade parts are required.
• Standards-Conscious Compliance: RoHS compliance supports regulatory alignment for lead-free manufacturing and distribution.

Why Choose 1SG110HN1F43E2LG?

This Stratix 10 GX device combines very large programmable fabric, substantial embedded memory, and a high I/O count in a compact 1760-BBGA package—making it well suited for teams developing bandwidth- and compute-focused systems. The part’s electrical and thermal specifications (820–880 mV core voltage; 0 °C to 100 °C operating range) allow designers to plan power delivery and thermal solutions around known constraints.

For projects that require scalable logic capacity, extensive on-chip RAM, and dense external connectivity—backed by the Stratix 10 family design documentation—this device provides a platform for building complex, high-performance FPGA-based systems.

Request a quote or contact sales to discuss availability, lead times, and how 1SG110HN1F43E2LG can be integrated into your next design.