1SG085HN3F43I3XG

The 1SG085HN3F43I3XG is an Intel Stratix® 10 GX FPGA optimized for high-density, high-bandwidth digital designs. Built on the Stratix 10 family architecture, it delivers large logic capacity and system-level integration for advanced communications, networking, and compute-oriented applications.

This device targets designs requiring extensive I/O, on-chip memory, and industrial-grade operating range, combining 850,000 logic elements with a broad set of family-level innovations such as the Intel Hyperflex core architecture and 14 nm tri-gate process to address demanding performance and integration requirements.

Key Features

• Logic Capacity — 850,000 logic elements provide substantial programmable fabric for large-scale, custom logic implementations.
• On-chip Memory — 71,303,168 total RAM bits enable large buffering, packet processing, and data staging within the FPGA fabric.
• I/O and Packaging — 688 user I/O pins delivered in a 1760-BBGA (1760-FBGA, 42.5 × 42.5 mm) surface-mount package for high-pin-count system designs.
• Power Supply — Core voltage supply range specified at 820 mV to 880 mV for the device core.
• Industrial Temperature Range — Rated for operation from −40 °C to 100 °C, suitable for industrial environments.
• Family-Level High-Speed Capabilities — Stratix 10 family innovations include Hyperflex architecture and heterogeneous 3D SiP transceiver tiles; family transceiver capabilities include high-speed serial links and advanced transceiver features.
• Embedded DSP and Memory Primitives (Family) — Stratix 10 family includes M20K memory blocks and variable-precision DSP blocks for high-performance signal processing workloads.
• Mounting and Compliance — Surface-mount FCBGA package; RoHS compliant.

Typical Applications

• High‑Performance Networking — Large logic density and extensive I/O support complex packet processing, switching fabrics, and protocol offload implementations.
• Data Center and Accelerators — On-chip RAM and DSP-building blocks (family features) combined with high logic capacity allow hardware acceleration for compute and data-path workloads.
• Telecommunications Equipment — High pin count and family-level transceiver capabilities suit backplane, line-card, and optical aggregation designs.
• Industrial Systems — Industrial-grade temperature range and robust packaging accommodate control, automation, and instrumentation applications requiring reliable operation across wide temperatures.

Unique Advantages

• High Logic Density: 850,000 logic elements enable large, complex designs without partitioning across multiple devices.
• Substantial On‑Chip Memory: Over 71 million RAM bits support deep buffering, large lookup tables, and stateful processing inside the FPGA fabric.
• Extensive I/O in a Compact Package: 688 I/O pins in a 1760-FBGA (42.5 × 42.5 mm) package provide dense connectivity while remaining a surface-mount solution.
• Industrial Reliability: −40 °C to 100 °C operating range and surface-mount FCBGA packaging suit deployment in industrial environments.
• Family-Level Performance Innovations: The Stratix 10 family’s Hyperflex architecture and 14 nm tri-gate process offer the architectural foundation for improved core performance and efficiency in applicable designs.
• Regulatory Compliance: RoHS compliance supports environmentally conscious manufacturing and assembly processes.

Why Choose 1SG085HN3F43I3XG?

The 1SG085HN3F43I3XG positions itself where high logic capacity, heavy on-chip memory, and broad I/O count are required for demanding digital systems. Its Stratix 10 family heritage brings architectural innovations that support high-throughput, compute-heavy, and connectivity-focused designs while meeting industrial temperature requirements.

This device is suited for engineers and teams designing advanced networking, data center acceleration, and industrial processing systems that need a balance of programmable logic, integrated memory resources, and dense external connectivity, backed by Intel’s Stratix 10 FPGA family platform.

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