1SG085HN3F43I1VG

The 1SG085HN3F43I1VG is an Intel Stratix® 10 GX field programmable gate array (FPGA) in a 1760-BBGA (FCBGA) package. It delivers a high logic capacity FPGA fabric with large on-chip RAM and dense I/O suited for advanced, high-performance applications.

As part of the Stratix 10 GX family, the device benefits from the family’s Hyperflex core architecture and 14 nm FinFET innovations that target higher core performance and improved power efficiency, addressing demanding bandwidth and processing requirements in communications, compute acceleration, and high-speed data systems.

Key Features

• Logic Capacity  850,000 logic elements (cells) provide significant programmable fabric for complex designs and high gate-count implementations.
• Embedded Memory  71,303,168 total RAM bits of on-chip memory to support large buffering, packet processing, and data-intensive algorithms.
• I/O Density  688 user I/O pins enable high channel counts and wide parallel interfaces for high-speed boards and modules.
• High-performance Family Innovations  Stratix 10 GX family-level innovations include the Intel Hyperflex core architecture and Intel 14 nm tri-gate (FinFET) technology, delivering higher core performance and improved power characteristics compared to prior-generation high-performance FPGAs.
• Power Supply  Core voltage range 770 mV to 970 mV for flexible power-domain design and supply choices.
• Package and Mounting  1760-BBGA (FCBGA) package, supplier device package 1760-FBGA with 42.5 × 42.5 mm footprint; surface-mount mounting for board-level assembly.
• Temperature Range  Industrial operating range −40 °C to 100 °C for deployment in temperature-challenging environments.
• Compliance  RoHS compliant.

Typical Applications

• Data Center and Compute Acceleration  Large logic capacity and abundant on-chip RAM support hardware acceleration, custom compute pipelines, and packet processing engines.
• Networking and Telecommunications  High I/O density and Stratix 10 family transceiver and IP capabilities make the device suitable for high-bandwidth switch, router, and line-card functions.
• High-Speed Data Acquisition  Ample logic and memory resources enable real-time processing and buffering for instrumentation and test systems.
• Backplane and Module Interfaces  Dense I/O and package options fit high-performance backplane and module-level integration requirements.

Unique Advantages

• High programmable capacity: 850,000 logic elements provide headroom for complex, multi-function designs without external logic expansion.
• Large on-chip memory: Over 71 million bits of embedded RAM reduce dependence on external DRAM for many buffering and processing tasks, simplifying board design.
• Dense I/O for system integration: 688 I/O pins support wide parallel buses, multiple interfaces, and high channel counts on a single device.
• Industrial temperature capability: −40 °C to 100 °C rating supports deployment in industrial and other temperature-demanding applications.
• Compact, manufacturable package: 1760-FBGA (42.5 × 42.5 mm) surface-mount package balances pin density and board-level assembly requirements.
• Stratix 10 family performance improvements: Family-level architectural advances (Hyperflex core and 14 nm FinFET) target increased core performance and improved power efficiency for demanding designs.

Why Choose 1SG085HN3F43I1VG?

The 1SG085HN3F43I1VG positions itself as a high-capacity, high-I/O Stratix 10 GX FPGA for engineers building advanced communications, compute, and data-processing systems. With 850,000 logic elements, substantial on-chip RAM, and a 688-pin I/O interface in a 1760-BBGA package, it provides the resources needed to consolidate functionality and simplify system architectures.

Backed by the Stratix 10 family innovations and Intel documentation, this device is suited for designers who require a scalable, high-performance programmable platform with industrial temperature capability and RoHS compliance.

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