1SG085HN3F43E3XG

The 1SG085HN3F43E3XG is an Intel Stratix® 10 GX field programmable gate array in a 1760-BBGA (1760-FBGA, 42.5×42.5) package. It combines the Stratix 10 family’s Hyperflex core architecture and high-performance transceiver capabilities to address advanced, high-bandwidth processing applications.

Designed for demanding systems, this device integrates a large programmable fabric with extensive on-chip memory and up to 688 I/O to support complex logic, high-speed connectivity, and embedded system functions while operating across a 0 °C to 100 °C range.

Key Features

• Logic Capacity  850,000 logic elements (LEs) for large-scale FPGA designs and complex custom logic integration.
• On-chip Memory  71,303,168 total RAM bits (internal SRAM blocks such as M20K are used across the Stratix 10 family).
• I/O Count  688 I/O pins to support extensive peripheral and high-speed interface routing.
• High-speed Transceivers  Family-level transceiver support includes data rates up to 28.3 Gbps for chip-to-chip/module and backplane links.
• Hard IP and Protocol Support  Stratix 10 family includes hard PCI Express Gen3 x16, 10G Ethernet hard IP and memory controller/PHY support for DDR4 up to 2666 Mbps per pin.
• Advanced Core Architecture  Intel Hyperflex core architecture delivers a step-up in core performance as documented for Stratix 10 devices.
• Power Supply  Core voltage supply range 820 mV to 880 mV.
• Package and Mounting  1760-BBGA (supplier package: 1760-FBGA, 42.5×42.5 mm), surface-mount.
• Operating Range  Rated for 0 °C to 100 °C operating temperature; device grade: Extended.
• Compliance  RoHS compliant.

Typical Applications

• High-performance Networking  Use in line cards, switches, and routers where high-speed transceivers and large logic capacity enable complex packet processing and protocol offload.
• Data Center Acceleration  Hardware acceleration for compute and storage applications leveraging large programmable fabric, extensive on-chip RAM, and hard PCIe/ethernet IP.
• High-speed SerDes Systems  Backplane and chip-to-chip connectivity requiring multi-gigabit transceiver channels up to 28.3 Gbps.
• Advanced Signal Processing  DSP-intensive workloads using the Stratix 10 family’s variable-precision DSP blocks and large logic/memory resources.

Unique Advantages

• High Logic Density: 850,000 logic elements provide headroom for extensive custom logic and complex control algorithms within a single device.
• Substantial On-chip Memory: Over 71 million RAM bits enable large buffering, lookup tables, and stateful processing without immediate reliance on external memory.
• Broad I/O and Package Density: 688 I/O in a 1760-BBGA package supports dense board-level connectivity for multi-interface designs.
• Family-level High-speed Connectivity: Transceiver capabilities and hard protocol IP (PCIe Gen3 x16, 10G Ethernet, DDR4 PHY) simplify integration of high-bandwidth interfaces.
• Performance-focused Architecture: Intel Hyperflex core architecture and 14 nm process innovations (as documented for Stratix 10 devices) deliver improved core performance for compute-heavy designs.
• Regulatory and Assembly Ready: Surface-mount 1760-FBGA package and RoHS compliance align with modern assembly and environmental requirements.

Why Choose 1SG085HN3F43E3XG?

The 1SG085HN3F43E3XG places the capabilities of the Stratix 10 GX family into a high-density 1760-BBGA package, offering a balance of large programmable fabric, extensive on-chip memory, and substantial I/O for advanced system designs. Its documented family features—Hyperflex architecture, high-speed transceivers, and hard IP for PCIe and Ethernet—make it suitable for customers building high-bandwidth networking, acceleration, and signal-processing solutions.

For designs requiring scalability, robust on-chip resources, and high-speed external interfaces, this device provides a platform aligned with Stratix 10 family innovations and the electrical and thermal operating parameters specified for this part.

Request a quote or submit an inquiry today to get pricing and availability information for 1SG085HN3F43E3XG.