1SG085HN3F43E2VG

The 1SG085HN3F43E2VG is an Intel Stratix® 10 GX FPGA in a 1760-ball FCBGA package (42.5 × 42.5 mm) designed for high-density programmable logic and I/O integration. This device delivers a large logic fabric coupled with substantial on-chip RAM and extensive I/O to address demanding communications, networking, and compute-centric applications.

Built on the Stratix 10 family platform, the device incorporates family-level innovations such as the Intel Hyperflex core architecture and Intel 14 nm tri-gate (FinFET) process. It is supplied with an extended-grade temperature rating and RoHS compliance for regulated manufacturing environments.

Key Features

• Logic Capacity — 850,000 logic elements to implement complex programmable logic, custom accelerators, and large-scale state machines.
• On-Chip Memory — 71,303,168 total RAM bits providing ample embedded SRAM for buffering, lookup tables, and local data storage.
• High-Density I/O — 688 I/O pins supporting extensive external interfacing for multi-channel systems and high-pin-count designs.
• Core Architecture (Family) — Built on the Intel Stratix 10 family featuring the Intel Hyperflex core architecture and 14 nm tri-gate (FinFET) technology for improved core performance and power efficiency.
• Package and Mounting — 1760-BBGA (FCBGA) surface-mount package; supplier device package listed as 1760-FBGA (42.5 × 42.5 mm) for board-level planning.
• Power Supply — Core voltage supply range of 770 mV to 970 mV to match system power-rail planning and sequencing requirements.
• Temperature and Grade — Extended grade with operating temperature range of 0 °C to 100 °C for deployments requiring above-commercial thermal performance.
• Compliance — RoHS compliant to support environmental and regulatory requirements in manufacturing.

Typical Applications

• High-Speed Networking — Implement packet processing, traffic management, and protocol acceleration where dense logic and abundant I/O are required.
• Data Center & Acceleration — Use for custom hardware accelerators, virtualized logic fabrics, and high-throughput data manipulation leveraging large logic capacity and on-chip RAM.
• Telecommunications — Deploy in backplane and module designs that require many I/Os and programmable logic for link aggregation, switching, and protocol offload.
• Complex FPGA-Based Systems — Suitable for systems that combine large state machines, DSP pipelines, and extensive peripheral interfaces within a single FPGA package.

Unique Advantages

• High Logic Density: 850,000 logic elements enable implementation of large designs without partitioning across multiple devices.
• Substantial On-Chip RAM: Over 71 million bits of embedded RAM reduce dependence on external memory for many buffering and lookup requirements.
• Extensive External Connectivity: 688 I/Os provide flexibility to connect numerous high-pin-count peripherals, mezzanine cards, or backplane interfaces.
• Advanced Process and Architecture: Leverages Stratix 10 family technologies including the Hyperflex core architecture and 14 nm tri-gate process for improved logic performance and power characteristics.
• Board-Level Ready Package: 1760-ball FCBGA (42.5 × 42.5 mm) enables compact, high-density board layouts for space-constrained designs.
• Design-Ready Specifications: Clear voltage supply range and extended operating temperature simplify system power sequencing and thermal planning.

Why Choose 1SG085HN3F43E2VG?

The 1SG085HN3F43E2VG positions itself as a high-density Stratix 10 GX FPGA offering a combination of large logic capacity, significant embedded RAM, and extensive I/O in a single FCBGA package. It is well suited to designers who need to consolidate complex processing, buffering, and multi-channel interfacing into one programmable device while adhering to extended temperature requirements.

Choosing this device provides a path to scalable, high-performance FPGA designs supported by Intel’s Stratix 10 family-level technologies. Its mix of core architecture innovations, package density, and clear electrical and thermal specifications make it appropriate for advanced networking, compute acceleration, and telecom platforms.

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