1SG085HN2F43I2VG

The 1SG085HN2F43I2VG is an Intel Stratix® 10 GX field programmable gate array (FPGA) offered in a 1760-BBGA (FCBGA) package. It provides 850,000 logic elements and 71,303,168 total RAM bits in a surface-mount form factor targeted at industrial applications.

Built on the Stratix 10 GX family architecture, this device leverages family-level innovations such as the Intel Hyperflex™ core architecture and Intel 14 nm tri-gate (FinFET) technology to address high-bandwidth, high-performance processing needs where integration, low-voltage operation, and dense I/O are required.

Key Features

• Core & architecture  Intel Stratix 10 GX family innovations including the Hyperflex core architecture and 14 nm tri-gate process as described in the device overview.
• Logic capacity  850,000 logic elements for complex programmable logic and large-scale custom logic implementations.
• On‑chip memory  71,303,168 total RAM bits, with family-level support for M20K internal SRAM memory blocks for dense embedded storage.
• High‑speed I/O  688 I/O pins to support wide parallel interfaces and system integration.
• Transceiver & connectivity (family features)  Stratix 10 GX family supports high-performance transceivers and advanced PHY/IP functions, including heterogeneous 3D SiP transceiver tiles and multi-gigabit rates described in the device overview.
• Power & supply  Low-voltage core operation with specified voltage supply range 770 mV to 970 mV to support power-optimized designs.
• Package & mounting  1760-FBGA package (42.5 mm × 42.5 mm) in a 1760-BBGA FCBGA footprint, surface-mount mounting for board-level assembly.
• Industrial temperature grade  Rated for operation from −40 °C to 100 °C for use in industrial environments.
• System features (family-level)  Family documentation highlights hard IP blocks (PCIe Gen3, memory controllers), variable-precision DSP blocks, and security/configuration features such as Secure Device Manager and SEU detection and correction.
• Compliance  RoHS compliant.

Typical Applications

• Data center and network appliances  Use the large logic capacity and dense I/O for packet processing, switching fabrics, and custom acceleration functions.
• High-performance compute and DSP  Leverage extensive on-chip RAM and family DSP capabilities for algorithm acceleration and signal processing workloads.
• Communications and backplane systems  Support multi-gigabit connectivity and wide parallel interfaces using the device I/O and Stratix 10 GX transceiver architecture.
• Industrial control and automation  Industrial temperature rating and surface-mount package make the device suitable for demanding embedded control and processing applications.

Unique Advantages

• High programmable capacity: 850,000 logic elements enable large-scale custom logic designs and complex system integration within a single device.
• Large embedded memory: Over 71 million bits of on-chip RAM reduce dependence on external memory and improve data throughput for memory-intensive tasks.
• Dense I/O surface: 688 I/O pins support broad connectivity and parallel interface requirements without adding external bridge components.
• Low-voltage core operation: 770 mV–970 mV supply range supports power-optimized designs and modern system power rails.
• Industrial temperature range: −40 °C to 100 °C operation supports deployment in industrial environments where extended temperature tolerance is required.
• Stratix 10 family technologies: Access to family-level innovations such as the Hyperflex core, advanced transceiver tiles, hard IP blocks, and documented system features for integration and performance scaling.

Why Choose 1SG085HN2F43I2VG?

The 1SG085HN2F43I2VG combines substantial programmable logic capacity, large on-chip memory, and a high I/O count in a single industrial-grade FCBGA package. It is positioned for designers who need a high-density FPGA platform that aligns with Stratix 10 GX family capabilities to implement compute-intensive, high-throughput, and tightly integrated systems.

With family-level architectural advances and a documented feature set, this device is suitable for teams building complex communication, acceleration, and industrial processing solutions that demand scalability, dense integration, and robust thermal performance.

Request a quote or submit an inquiry to receive pricing, availability, and ordering information for the 1SG085HN2F43I2VG.