1SG085HN2F43E2LG

The Intel Stratix® 10 GX FPGA 1SG085HN2F43E2LG is a high-capacity programmable logic device in a 1760-BBGA (FCBGA) package. It is part of the Stratix 10 GX family that features the Intel Hyperflex™ core architecture and Intel 14 nm tri-gate (FinFET) process technology for enhanced core performance and power efficiency.

This device provides 850,000 logic elements, 71,303,168 bits of on-chip RAM and 688 I/O pins in a surface-mount 1760-FBGA (42.5 × 42.5 mm) footprint. It is specified for an operating supply range of 820 mV to 880 mV, an operating temperature range of 0 °C to 100 °C, and is RoHS compliant with Extended grade classification.

Key Features

• Core & Architecture  Intel Hyperflex™ core architecture and Intel 14 nm tri-gate (FinFET) process technology delivering increased core performance and energy efficiency for compute- and bandwidth-intensive designs.
• Logic Capacity  850,000 logic elements for large-scale programmable logic implementations and complex system integration.
• On‑Chip Memory  71,303,168 total RAM bits and family support for M20K internal SRAM memory blocks to accelerate buffering, packet processing, and algorithmic memory needs.
• High I/O Count & Package  688 I/O pins in a 1760-BBGA (supplier package: 1760-FBGA, 42.5 × 42.5 mm) surface-mount package to support dense connectivity and board-level routing.
• Power & Thermal  Supported core voltage supply from 820 mV to 880 mV and Extended-grade operating temperature range of 0 °C to 100 °C; the Stratix 10 family includes power-management features for efficient operation.
• High-Speed I/O and Transceiver Technology  Stratix 10 GX family devices incorporate high-performance transceiver and SERDES capabilities suitable for high-bandwidth links (family datasheet references high-rate transceiver performance and hard IP for common protocols).
• Packaging & Mounting  Surface-mount FCBGA package (1760-BBGA) designed for high-density boards and automated assembly processes.
• Compliance  RoHS compliant.

Typical Applications

• High‑Performance Networking  Used for packet processing, switching, and protocol bridging where high logic density, large on-chip RAM and high-speed transceiver capability enable complex forwarding and telemetry functions.
• Data Center Acceleration  Suitable for hardware acceleration tasks that benefit from large programmable fabric and memory resources, plus extensive I/O for host and module interfacing.
• Communications & Optical Transport  Enables implementation of high-bandwidth link controllers, forward error correction, and protocol processing leveraging the Stratix 10 GX family transceiver and hard-IP features.
• Test, Measurement & Instrumentation  Provides the logic capacity and deterministic I/O control needed for high-channel-count signal processing and real-time measurement systems.

Unique Advantages

• Large Logic Fabric: 850,000 logic elements enable integration of complex algorithms and multiple subsystems into a single device, reducing board-level BOM.
• Substantial On‑Chip Memory: Over 71 million RAM bits support deep buffering and on-chip data structures for high-throughput designs.
• High I/O Density: 688 I/O pins in a compact 1760-FBGA package allow extensive external interfacing without large packages.
• Advanced Core Technology: Hyperflex architecture and 14 nm FinFET process deliver measured increases in core performance and power efficiency at the family level.
• Extended Temperature Grade: Rated 0 °C to 100 °C for reliable operation across a broad range of environments where Extended-grade qualification is required.
• RoHS Compliant: Meets environmental compliance requirements for lead-free assembly.

Why Choose 1SG085HN2F43E2LG?

The 1SG085HN2F43E2LG Stratix 10 GX FPGA combines substantial logic capacity, large on-chip memory, and a high I/O count in a compact FCBGA package—making it well suited for high-bandwidth, compute-intensive applications that demand integrated, programmable solutions. As part of the Stratix 10 GX family, it benefits from the Hyperflex core architecture and Intel 14 nm FinFET process advancements documented in the family datasheet.

This device is targeted at designers and systems integrators building networking, data center, communications, and test-and-measurement equipment who need scalable logic resources, deterministic I/O, and family-level high-speed transceiver capabilities, while maintaining Extended temperature operation and RoHS compliance.

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