1SG085HN2F43I2LG

The 1SG085HN2F43I2LG is an Intel Stratix® 10 GX field programmable gate array packaged in a 1760-BBGA (1760-FBGA 42.5×42.5 mm) surface-mount package. It delivers a high-density programmable fabric with 850,000 logic elements and 71,303,168 bits of embedded RAM for advanced, compute- and bandwidth-intensive designs.

Designed for industrial-grade applications, this device provides extensive I/O (688 pins), a low-voltage core supply range (820 mV to 880 mV), and an operating temperature range of –40 °C to 100 °C. Family-level innovations documented for Stratix 10 devices include the Intel Hyperflex core architecture and high-performance transceiver and memory subsystems.

Key Features

• Core Architecture  Part of the Intel Stratix 10 GX family with Hyperflex core architecture referenced in the device overview for high-performance implementations.
• Logic Density  850,000 logic elements suitable for large-scale, complex logic designs.
• Embedded Memory  71,303,168 total RAM bits to support large on-chip buffering, caches, and state storage.
• I/O and Packaging  688 I/O pins in a 1760-BBGA package; supplier device package listed as 1760-FBGA (42.5×42.5 mm) for high-pin-count system integration.
• Power  Core voltage supply range of 820 mV to 880 mV for designs targeting low-voltage power domains.
• Temperature and Grade  Industrial grade device with an operating range of –40 °C to 100 °C for deployment in demanding environments.
• Mounting  Surface-mount package suitable for automated PCB assembly and high-density board layouts.

Typical Applications

• High‑Performance Networking  Implement protocol offload, packet processing, and high-throughput switching where dense logic and abundant RAM are needed.
• Data Center Acceleration  Use for FPGA-based accelerators requiring large logic capacity and on-chip memory for buffering and compute kernels.
• High-Speed Serial and Backplane Interfaces  Integrate complex interface logic and I/O routing for systems with extensive connectivity requirements.
• Advanced Signal Processing  Deploy large-scale DSP and pipeline implementations benefiting from high logic density and embedded memory.

Unique Advantages

• High Logic Capacity: 850,000 logic elements enable very large designs without partitioning across multiple devices.
• Substantial On‑Chip RAM: Over 71 million bits of RAM reduce dependence on external memory for latency‑sensitive buffering and state retention.
• Extensive I/O Count: 688 I/O pins support complex board-level routing and multiple high-speed interfaces.
• Industrial‑Grade Reliability: Rated for –40 °C to 100 °C operation to meet environmental robustness requirements.
• Compact High‑Pin Package: 1760-FBGA (42.5×42.5 mm) delivers high pin count in a package suited for dense system designs.
• Low‑Voltage Core Support: 820 mV to 880 mV supply range supports power-optimized system architectures.

Why Choose 1SG085HN2F43I2LG?

This Stratix® 10 GX FPGA part positions itself for demanding, high-density FPGA applications that require a large logic fabric, significant on-chip RAM, and a high count of I/O in a single, industrial-grade package. It is well suited for teams building high-throughput networking, data center acceleration, and advanced signal-processing systems that need scalable, integrated programmable logic.

Choosing this device brings the benefits of the Stratix 10 family-level innovations alongside verified package, power, and thermal characteristics—enabling designs that balance performance, integration, and reliability for long-term deployment.

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