1SG085HN2F43I1VG
| Part Description |
Stratix® 10 GX Field Programmable Gate Array (FPGA) IC 688 850000 1760-BBGA, FCBGA |
|---|---|
| Quantity | 685 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1760-FBGA (42.5x42.5) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1760-BBGA, FCBGA | Number of I/O | 688 | Voltage | 770 mV - 970 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 106250 | Number of Logic Elements/Cells | 850000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 71303168 |
Overview of 1SG085HN2F43I1VG – Stratix® 10 GX FPGA, 850,000 Logic Elements, 688 I/O, 1760-FBGA
The 1SG085HN2F43I1VG is an Intel Stratix® 10 GX field programmable gate array (FPGA) in a 1760-BBGA FCBGA package. It pairs a high-density programmable fabric—850,000 logic elements—with on-chip RAM and extensive I/O to address demanding, industrial-grade applications.
Built on the Stratix 10 family architecture, the device takes advantage of the Intel Hyperflex core architecture and 14 nm process innovations described for Stratix 10 devices, delivering higher core performance and integration for compute- and bandwidth-intensive designs.
Key Features
- Programmable Fabric — 850,000 logic elements (cells) providing the gate count needed for complex custom logic and algorithm acceleration.
- Logic Structure — 106,250 LAB-equivalent elements reported in family data, enabling large-scale logic partitioning and design flexibility.
- On‑Chip Memory — 71,303,168 total RAM bits for buffering, packet processing, and intermediate data storage within the FPGA fabric.
- I/O Density & Package — 688 user I/O pins in a 1760-BBGA (1760-FBGA, 42.5 × 42.5 mm) package for high-pin-count board designs and dense board-level routing.
- Power Supply — Core voltage range 770 mV to 970 mV to match platform power architectures and regulator designs.
- Thermal & Environmental — Industrial operating temperature range from −40 °C to 100 °C and RoHS compliant.
- Stratix 10 Family Innovations — Family-level features include the Intel Hyperflex core architecture, 14 nm tri‑gate FinFET technology, heterogeneous 3D SiP transceiver tiles, and support for hard IP blocks such as PCIe and memory controllers (as described in the Stratix 10 device overview).
Typical Applications
- High‑Performance Networking — Use the high logic density, large on‑chip RAM, and dense I/O to implement packet processing, switches, and line cards requiring substantial custom logic and buffering.
- Data Center Acceleration — Suitable for hardware acceleration tasks and custom compute pipelines that need large logic capacity and high I/O connectivity.
- Telecommunications & Backplane Processing — The package I/O count and family transceiver capabilities support complex backplane and modular telecom applications.
- Industrial Systems — Industrial-grade temperature range and robust packaging make the device appropriate for industrial automation, test equipment, and instrumentation systems requiring programmable logic at scale.
Unique Advantages
- High Logic Capacity: 850,000 logic elements enable implementation of large, multi‑function designs without immediate partitioning to external logic.
- Substantial On‑Chip Memory: Over 71 million RAM bits reduce dependence on external memory for many buffering and intermediate storage needs, simplifying board-level BOM.
- Dense I/O in a Compact Package: 688 I/O in a 1760-FBGA (42.5 × 42.5 mm) footprint provides a balance of high connectivity and manageable board area.
- Industrial Temperature Range: −40 °C to 100 °C operation supports deployment in harsh or temperature‑variable environments.
- Family-Level Performance Innovations: Benefits from Stratix 10 family technologies such as Hyperflex core architecture and 14 nm FinFET process improvements for increased performance-per-area.
- RoHS Compliant: Meets environmental compliance requirements for modern electronics assemblies.
Why Choose 1SG085HN2F43I1VG?
The 1SG085HN2F43I1VG positions itself as a high-density, industrial-grade Stratix 10 GX FPGA option where large logic capacity, significant on‑chip memory, and high I/O count are primary requirements. It is suited to engineers and system designers building high-throughput, compute- or I/O-bound systems that benefit from Stratix 10 family architectural advances.
Choosing this device provides a scalable, programmable platform with the integration and thermal range needed for long-term deployment in networking, data center acceleration, telecom, and industrial applications, backed by the Stratix 10 device family's documented architecture and features.
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