1SG085HN2F43E2VG
| Part Description |
Stratix® 10 GX Field Programmable Gate Array (FPGA) IC 688 850000 1760-BBGA, FCBGA |
|---|---|
| Quantity | 635 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1760-FBGA (42.5x42.5) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1760-BBGA, FCBGA | Number of I/O | 688 | Voltage | 770 mV - 970 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 106250 | Number of Logic Elements/Cells | 850000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 71303168 |
Overview of 1SG085HN2F43E2VG – Stratix® 10 GX FPGA, 850,000 Logic Elements, 688 I/Os, 1760-BBGA
The 1SG085HN2F43E2VG is an Intel Stratix® 10 GX field programmable gate array (FPGA) offered in a 1760-BBGA (FCBGA) package. It features a high logic capacity and extensive I/O, targeting advanced designs that require high bandwidth, large on-chip memory, and high-density programmable logic.
As part of the Stratix 10 family, this device benefits from the series’ architectural innovations and high-performance feature set to support demanding applications in networking, data acceleration, and high-performance compute where performance, integration, and efficiency are critical.
Key Features
- Logic Capacity 850,000 logic elements for implementing large-scale digital logic and complex custom architectures.
- On‑chip Memory 71,303,168 total RAM bits to support large buffering, state storage, and memory-intensive algorithms.
- I/O Density 688 device I/Os to support wide external interfaces, multiple high-speed links, and dense board-level connectivity.
- Package 1760-BBGA (1760-FBGA, 42.5 × 42.5 mm) surface-mount package for high pin-count system designs.
- Power Supply Core voltage operation between 770 mV and 970 mV for compatibility with low-voltage system power domains.
- Operating Temperature & Grade Extended grade operation from 0 °C to 100 °C suitable for a broad set of commercial and industrial-adjacent environments.
- Family Innovations Stratix 10 family features cited in the device overview include the Intel Hyperflex core architecture and Intel 14 nm tri-gate (FinFET) technology, contributing to higher core performance and efficiency.
- Standards Compliance RoHS compliant, meeting common environmental restrictions for electronic components.
Typical Applications
- High‑Performance Networking Implement high-throughput switching, packet processing, and transceiver interfaces using the device’s high logic capacity and large I/O complement.
- Data Center Acceleration Offload compute-intensive or latency-sensitive workloads using large internal RAM and dense programmable logic for custom accelerators.
- Telecommunications Equipment Deploy in systems that require flexible protocol handling and high I/O counts for backplane and module connectivity.
- Signal Processing and DSP Support wideband signal processing and large buffering needs leveraging the device’s memory and logic resources.
Unique Advantages
- High Logic Density: 850,000 logic elements enable complex designs and significant algorithmic implementation on a single device, reducing the need for multi‑FPGA partitioning.
- Large On‑Chip Memory: Over 71 million bits of RAM provide capacity for deep buffering, state machines, and data‑intensive application needs without relying on external memory.
- Extensive I/O Options: 688 I/Os allow flexible board-level interfacing for high-channel-count systems and multiple high-speed links.
- Compact High‑Pin Package: The 1760-FBGA (42.5 × 42.5 mm) package delivers dense connectivity in a surface-mount form factor suitable for space-constrained designs.
- Low‑Voltage Core Operation: Core supply range of 770 mV–970 mV supports modern low-voltage system power architectures and efficient power budgeting.
- Extended Operating Range: Rated 0 °C–100 °C and designated Extended grade for use in environments that require extended commercial temperature tolerance.
Why Choose 1SG085HN2F43E2VG?
The 1SG085HN2F43E2VG delivers a combination of high logic density, large on-chip memory, and broad I/O that addresses demanding system requirements for bandwidth, buffering, and complex programmable logic. Its inclusion in the Stratix 10 GX family brings architectural benefits noted in the device overview—such as the Intel Hyperflex core architecture and 14 nm tri-gate technology—that support higher core performance and efficiency.
This device is well suited for engineers and system designers building high-performance networking, data center acceleration, telecommunications, and signal processing solutions that require a scalable, high-capacity programmable fabric with extensive I/O and on-chip RAM.
Request a quote or submit your specifications to get pricing and availability for the 1SG085HN2F43E2VG. Our team will respond with procurement options and lead-time information tailored to your project needs.

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