1SG085HN2F43I2VGAS
| Part Description |
Stratix® 10 GX Field Programmable Gate Array (FPGA) IC 688 850000 1760-BBGA, FCBGA |
|---|---|
| Quantity | 648 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1760-FBGA (42.5x42.5) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1760-BBGA, FCBGA | Number of I/O | 688 | Voltage | 770 mV - 970 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 106250 | Number of Logic Elements/Cells | 850000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 71303168 |
Overview of 1SG085HN2F43I2VGAS – Stratix® 10 GX FPGA, 1760‑BBGA (FCBGA)
The 1SG085HN2F43I2VGAS is a high‑density Intel Stratix® 10 GX field programmable gate array supplied in a 1760‑FBGA (42.5 × 42.5 mm) package. It delivers a large programmable fabric with 850,000 logic elements and extensive on‑chip RAM to address demanding, high‑performance system designs.
As a member of the Stratix 10 family, this device leverages family innovations including the Intel Hyperflex™ core architecture and Intel 14 nm tri‑gate process to provide performance and integration suitable for advanced networking, compute acceleration, and signal processing applications. The device is rated for industrial operation and offers a wide core voltage and temperature range for robust system deployment.
Key Features
- Core & architecture Part of the Intel Stratix 10 GX family with the Hyperflex™ core architecture and Intel 14 nm tri‑gate technology as described in the Stratix 10 device overview.
- Large programmable fabric Approximately 850,000 logic elements to implement complex digital designs and large FPGA partitions.
- Embedded memory Total on‑chip RAM of 71,303,168 bits for frame buffers, FIFOs, and embedded data storage.
- I/O density 688 general I/O pins to support high‑density interfacing to external devices and systems.
- Power supply Core voltage range from 770 mV to 970 mV to match modern low‑voltage system rails.
- Package & mounting 1760‑BBGA (FCBGA) surface‑mount package; supplier device package listed as 1760‑FBGA (42.5 × 42.5 mm) for high pin count in a compact footprint.
- Industrial temperature grade Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
- Standards & compliance RoHS‑compliant material status.
Typical Applications
- High‑speed networking and telecom Large logic capacity and high I/O count suit line cards, packet processing, and protocol offload functions within networking equipment.
- Data center acceleration Dense FPGA fabric and significant on‑chip RAM support compute acceleration and custom data‑path implementations for cloud and server platforms.
- Advanced signal processing On‑chip memory and large logic resources enable real‑time DSP pipelines and algorithm implementation for communications and instrumentation.
- High‑performance test & measurement High I/O density and the Stratix 10 family architecture accommodate complex timing, control, and capture functions required in lab and manufacturing test systems.
Unique Advantages
- Large programmable capacity: 850,000 logic elements provide space for complex system functions and multiple concurrent hardware accelerators.
- Substantial embedded RAM: 71,303,168 total RAM bits reduce external memory dependencies and improve data throughput for buffering and real‑time processing.
- High I/O pin count: 688 I/Os enable dense peripheral connectivity and wide parallel interfaces.
- Industrial robustness: −40 °C to 100 °C operating range and industrial grade classification support deployment in harsher environments.
- Compact, high‑pin package: 1760‑FBGA (42.5 × 42.5 mm) gives a high‑density solution for space‑constrained boards while maintaining extensive I/O.
- Family innovations: Benefits from Stratix 10 family technologies such as the Hyperflex core architecture and Intel 14 nm tri‑gate process for enhanced performance and efficiency at device level.
Why Choose 1SG085HN2F43I2VGAS?
This Stratix 10 GX device positions itself where high logic capacity, substantial on‑chip RAM, and high I/O density are required in industrial temperature environments. Its combination of 850,000 logic elements, 71,303,168 bits of embedded RAM, and 688 I/Os makes it suitable for system designers implementing complex, high‑bandwidth logic and data‑path functions.
Choosing this part provides a scalable programmable platform that benefits from Stratix 10 family architecture and ecosystem resources, enabling long‑term design flexibility and integration of advanced hardware functions while meeting industrial operational requirements.
Request a quote or submit an inquiry to obtain pricing, availability, and support information for the 1SG085HN2F43I2VGAS Stratix 10 GX FPGA.

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