1SG085HN3F43E2LG

IC FPGA 688 I/O 1760FBGA
Part Description

Stratix® 10 GX Field Programmable Gate Array (FPGA) IC 688 850000 1760-BBGA, FCBGA

Quantity 58 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package1760-FBGA (42.5x42.5)GradeExtendedOperating Temperature0°C – 100°C
Package / Case1760-BBGA, FCBGANumber of I/O688Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs106250Number of Logic Elements/Cells850000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits71303168

Overview of 1SG085HN3F43E2LG – Stratix® 10 GX FPGA, 850000 logic elements, 688 I/O, 1760-BBGA

The 1SG085HN3F43E2LG is an Intel Stratix® 10 GX Field Programmable Gate Array (FPGA) in a 1760-BBGA FCBGA package. It leverages the Stratix 10 family architecture, including the Intel Hyperflex™ core innovations and Intel 14 nm tri-gate (FinFET) process, to address applications requiring high bandwidth and high processing performance.

This device provides a combination of high logic density, substantial on-chip memory, and a large I/O complement, making it suited for demanding networking, data center, and signal processing applications where performance and integration matter.

Key Features

  • Core & Architecture  Intel Hyperflex™ core architecture built on Intel 14 nm tri-gate (FinFET) technology; family-level improvements include higher core performance and reduced power versus prior generations.
  • Logic Capacity  850,000 logic elements to implement large, complex FPGA designs.
  • On-Chip Memory  71,303,168 total RAM bits for deep buffering, packet processing, or large lookup tables.
  • I/O and Package  688 I/O pins in a 1760-BBGA FCBGA package (supplier package: 1760-FBGA, 42.5 × 42.5 mm); surface-mount construction for standard board-level assembly.
  • Transceivers & High-Speed Interfaces (family features)  Stratix 10 family documentation cites up to 96 full-duplex transceiver channels and transceiver data rates up to 28.3 Gbps, plus hard IP options such as PCI Express Gen3 and 10G Ethernet (see family datasheet for specifics).
  • Power  Core voltage supply range 820 mV to 880 mV, enabling low-voltage core operation as specified.
  • Thermal & Grade  Operating temperature range 0 °C to 100 °C and Extended grade classification as listed in the product data.
  • Compliance  RoHS compliant for lead-free manufacturing requirements.

Typical Applications

  • High-Performance Networking  Use the large logic fabric, high I/O count, and family transceiver capabilities to implement switching, routing, and line-card functions.
  • Data Center Acceleration  Deploy FPGA-based acceleration for packet processing, encryption, or custom workload offload where high logic density and on-chip memory are needed.
  • Telecommunications Infrastructure  Implement PHY, framing, and protocol processing using the device’s logic capacity and family-level high-speed interface support.
  • Signal Processing and DSP  Leverage the large RAM and logic resources for real-time processing pipelines and complex algorithms.

Unique Advantages

  • High logic density: 850,000 logic elements enable integration of large designs that reduce external component count.
  • Substantial on-chip memory: 71,303,168 RAM bits provide capacity for buffers, tables, and state storage without relying solely on external memory.
  • Extensive I/O in a compact package: 688 I/O in a 1760-BBGA (42.5 × 42.5 mm) package supports complex multi-interface designs while conserving board area.
  • Low-voltage core operation: 820–880 mV supply range supports efficient core power architecture.
  • Designed for high-bandwidth systems: Family-level features such as high-speed transceivers and hard IP (PCIe, Ethernet) align the device with demanding communications and data-center roles.
  • Extended temperature and RoHS compliance: 0 °C to 100 °C operating range and RoHS compliance for mainstream environmental requirements.

Why Choose 1SG085HN3F43E2LG?

This Stratix® 10 GX FPGA provides a high-capacity, high-performance programmable fabric in a production-ready package. With 850,000 logic elements, over 71 million bits of on-chip RAM, and 688 I/O, the device is positioned for complex designs that require significant integration and bandwidth. The Silicon-level architectural enhancements described in the Stratix 10 family allow designers to target advanced networking, data-center acceleration, and signal-processing applications while managing power and board complexity.

Choose this device when your design needs a combination of dense logic, large embedded memory, extensive I/O, and the family-level high-speed interface options documented for Stratix 10 GX devices. The Extended grade and specified operating limits support a wide range of commercial and enterprise deployments.

Request a quote or submit your procurement inquiry to receive pricing and availability information for 1SG085HN3F43E2LG.

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