1SG085HN3F43E3VG

The 1SG085HN3F43E3VG is a Stratix® 10 GX FPGA in a 1760-BBGA (FCBGA) package offering a high-density programmable fabric targeted at demanding, high-bandwidth applications. It combines 850,000 logic elements and 71,303,168 bits of on-chip RAM with a broad 688-pin I/O count to support complex compute and I/O-intensive designs.

As a member of the Stratix 10 GX family, this device is built on the Intel Hyperflex core architecture and Intel 14 nm tri-gate (FinFET) technology, delivering architecture-level performance advantages and system-level integration for advanced networking, compute acceleration, and high-speed data processing applications.

Key Features

• Core Logic 850,000 logic elements provide substantial programmable capacity for complex logic, control, and custom datapath implementation.
• On-Chip Memory 71,303,168 total RAM bits of embedded SRAM support large buffering, streaming, and lookup-table requirements without immediate external memory dependence.
• High-Density I/O 688 available I/O pins enable extensive external device interfacing, multi-channel data lanes, and broad system connectivity.
• Package and Mounting 1760-BBGA (FCBGA) package, supplier device package 1760-FBGA (42.5 × 42.5 mm), designed for surface-mount PCB assembly in compact, high-pin-count systems.
• Power Core voltage supply range of 770 mV to 970 mV allowing designers to match system power rails and manage core power domains.
• Temperature and Grade Extended grade device with an operating temperature range of 0 °C to 100 °C for use in applications requiring above-commercial temperature tolerance.
• Compliance RoHS compliant to meet standard environmental and materials requirements for lead-free assemblies.
• Family Technology Part of the Stratix 10 GX family leveraging the Intel Hyperflex core architecture and 14 nm tri-gate (FinFET) process for higher core performance and efficiency in the family ecosystem.

Typical Applications

• High‑performance Networking Implement packet processing, switching, and protocol offload with the device’s large logic capacity and high I/O count for multi‑lane interfaces.
• Data Center Acceleration Use on-chip RAM and extensive logic resources for custom acceleration of compute‑intensive workloads and inline data processing.
• High‑Speed Communications Support backplane and module designs that require dense I/O and substantial on‑chip memory for buffering and datapath functions.
• Advanced Signal Processing Realize DSP pipelines and streaming architectures that benefit from large embedded memory and significant programmable logic resources.

Unique Advantages

• Large Programmable Capacity: 850,000 logic elements enable implementation of complex state machines, datapaths, and custom accelerators on a single device.
• Substantial On‑Chip RAM: 71,303,168 bits of embedded SRAM reduce the need for external memory in many buffering and lookup applications, simplifying system design.
• Extensive I/O Count: 688 I/O pins support multi‑channel interfaces and rich external connectivity without immediate multiplexing tradeoffs.
• Compact High‑Pin Package: The 1760‑FBGA footprint (42.5 × 42.5 mm) balances a high pin count with a compact board area for space‑constrained, high‑performance systems.
• Low‑Voltage Core Compatibility: Core supply range of 770 mV to 970 mV accommodates modern low‑voltage system domains and power optimization strategies.
• Extended Operational Range: Extended grade operation from 0 °C to 100 °C provides a wider usable temperature window for many commercial and industrial-adjacent applications.

Why Choose 1SG085HN3F43E3VG?

The 1SG085HN3F43E3VG delivers a balance of high logic density, large on‑chip memory, and extensive I/O in a single Stratix 10 GX FPGA package. Its presence in the Stratix 10 family gives designers access to the Hyperflex core architecture and 14 nm FinFET process advantages for applications demanding high throughput and significant programmable resources.

This device is well suited for system designers building high‑bandwidth networking equipment, data center acceleration modules, or complex signal processing platforms that require integrated logic capacity, large embedded RAM, and numerous external interfaces while operating within a 0 °C to 100 °C temperature window.

Request a quote or submit an inquiry to receive pricing and availability information for the 1SG085HN3F43E3VG.