1SG085HN3F43E3VGAS

The 1SG085HN3F43E3VGAS is a Stratix® 10 GX FPGA in a 1760-BBGA (FCBGA) surface-mount package, offering a high-capacity programmable fabric with 850,000 logic elements and 106,250 adaptive logic modules. Designed for demanding data-path and system-acceleration roles, it targets applications that require large on-chip memory, extensive I/O, and advanced architecture-level features from the Stratix 10 family.

Built on the Stratix 10 family innovations, this device combines high logic density, abundant embedded RAM (71,303,168 total bits), and up to 688 I/O pins to support complex, high-throughput designs while operating within a 770 mV to 970 mV core supply range and an extended temperature grade of 0°C to 100°C.

Key Features

• Logic Capacity  Provides 850,000 logic elements (LEs) and 106,250 adaptive logic modules for large-scale programmable designs and complex control/compute implementations.
• On‑Chip Memory  Includes 71,303,168 total RAM bits suitable for buffering, packet processing, and intermediate data storage inside the FPGA fabric.
• I/O Density & Package  Up to 688 I/O pins in a 1760-BBGA (FCBGA) package with a 1760-FBGA (42.5 × 42.5 mm) supplier package footprint, enabling high connector and board‑level routing density.
• Power and Thermal  Core voltage supply range of 770 mV to 970 mV and an operating temperature range of 0°C to 100°C in an Extended grade for demanding board environments.
• Mounting & Compliance  Surface-mount package construction and RoHS compliance for compatibility with modern assembly processes and environmental requirements.
• Stratix 10 Family Innovations  Part of the Stratix 10 GX/SX family, which features the Intel Hyperflex™ core architecture, Intel 14 nm tri-gate (FinFET) process, high-performance transceiver and DSP capabilities, and hard IP blocks for PCI Express and Ethernet as described in the device family documentation.

Typical Applications

• High‑Performance Networking  Large logic capacity, abundant on-chip RAM, and high I/O count support packet processing, switching, and line-card FPGA functions.
• Telecom & Data Center Acceleration  Configured for complex protocol processing and hardware acceleration where dense logic and memory resources are required.
• High‑Speed I/O Systems  The package and I/O pin count make this device suitable for designs that require broad external interfacing and board-level connectivity.
• Signal Processing & DSP  Large on-chip RAM and Stratix 10 family DSP capabilities provide a platform for fixed/floating point signal processing pipelines and compute‑intensive tasks.

Unique Advantages

• High Logic Density: 850,000 logic elements enable integration of large RTL designs and consolidation of multiple functions into a single FPGA to reduce system BOM.
• Large Embedded Memory: Over 71 Mbit of on-chip RAM provides ample local storage for buffering and scratch memory, improving throughput and latency for streaming applications.
• Extensive I/O Capability: 688 I/O pins in a 1760-BBGA package support broad external interfacing and flexible board-level signal routing.
• Family-Level Architectural Benefits: As a Stratix 10 GX part, it benefits from the family innovations such as the Hyperflex core architecture and 14 nm tri-gate process noted in the device documentation, which support higher core performance and efficient silicon implementation.
• Manufacturing & Compliance Ready: Surface-mount packaging and RoHS compliance simplify integration into modern production flows and meet environmental requirements.
• Extended Grade Operation: Rated for 0°C to 100°C operation for systems requiring an extended temperature window without claiming industrial or automotive grades.

Why Choose 1SG085HN3F43E3VGAS?

The 1SG085HN3F43E3VGAS positions itself as a high-capacity Stratix 10 GX FPGA option for designs that demand large programmable fabric, significant embedded RAM, and a high pin-count package. Its combination of 850,000 logic elements, 71,303,168 bits of RAM, and 688 I/O pins makes it well suited to consolidate complex functions, accelerate data-path tasks, and support high-throughput system interfaces.

For teams developing advanced networking, data-center, or signal-processing hardware, this device offers the fabric and resources required to scale designs while leveraging the Stratix 10 family architecture documented for high-performance FPGA implementations.

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