1SG085HN3F43I2LG

The Intel Stratix® 10 GX 1SG085HN3F43I2LG is a high-density, industrial-grade FPGA in a 1760-BBGA FCBGA package designed for demanding, bandwidth- and compute-intensive applications. It combines the Stratix 10 family’s Hyperflex core architecture and 14 nm tri-gate (FinFET) technology with a large programmable fabric, extensive I/O, and family-level hard IP for high-speed serial and memory interfaces.

This device targets advanced use cases that require high logic capacity, large on-chip memory, and robust I/O — including networking, data-center acceleration, and high-speed communications — where performance, integration, and industrial temperature operation are required.

Key Features

• Core Architecture  Built on the Intel Stratix 10 family platform with the Intel Hyperflex core architecture and Intel 14 nm tri-gate (FinFET) technology for the family’s performance and power efficiency innovations.
• Logic Capacity  Provides 850,000 logic elements to implement large custom logic and algorithmic designs.
• On-chip Memory  71,303,168 total RAM bits of embedded memory to support buffering, lookup tables, and large on-chip data structures; the family also uses M20K internal SRAM memory blocks.
• I/O Density  688 user I/O pins to support extensive peripheral and board-level connectivity.
• High-speed Transceivers & Serial Links (family-level)  Stratix 10 family innovations include heterogeneous 3D SiP transceiver tiles with transceiver data rates up to 28.3 Gbps and full-duplex channels to support high-bandwidth chip-to-chip and backplane links.
• Hard IP and Protocol Support (family-level)  Family devices include hard IP blocks such as PCI Express Gen1/Gen2/Gen3, 10G Ethernet and Forward Error Correction (FEC) in transceiver channels, and hard memory controllers supporting DDR4 rates up to 2666 Mbps per pin.
• Power Supply  Core voltage supply specified from 820 mV to 880 mV for the device core domain.
• Package & Mounting  1760-BBGA FCBGA package (supplier package: 1760-FBGA, 42.5 × 42.5 mm) designed for surface-mount PCB assembly.
• Temperature & Grade  Industrial grade with an operating temperature range of −40 °C to 100 °C and RoHS compliance.

Typical Applications

• High-performance networking and switching  Leverages extensive I/O and high-speed transceiver capability to implement packet processing, switching fabrics, and line-rate protocol engines.
• Data center acceleration  Uses large logic capacity and abundant on-chip RAM for custom accelerators, packet inspection, and data-path offload functions.
• High-speed serial connectivity and backplane systems  Supports multi-gigabit chip-to-chip and backplane links with family-level transceiver features and FEC support for robust data transfer.
• Memory interface and protocol bridging  Combines hard memory controllers and programmable fabric for DDR4 interfacing and protocol conversion tasks.

Unique Advantages

• High logic density: 850,000 logic elements provide capacity for complex, large-scale designs without immediate migration to multi-chip solutions.
• Large on-chip memory: 71,303,168 total RAM bits enable extensive buffering and data-path storage directly in the FPGA fabric.
• Broad I/O bandwidth: 688 I/Os and family-level high-speed transceiver support let you route many interfaces and multi-gigabit links from a single device.
• Industrial reliability: Rated for −40 °C to 100 °C operation to meet the temperature demands of industrial deployments.
• Compact, production-ready package: 1760-BBGA FCBGA (42.5 × 42.5 mm) surface-mount package balances I/O count and thermal/mechanical integration for system designs.
• Standards-oriented IP (family-level): Family-level hard IP for PCIe and Ethernet and support for DDR4 memory interfaces reduce development time for common high-performance interfaces.

Why Choose 1SG085HN3F43I2LG?

The 1SG085HN3F43I2LG brings together the Stratix 10 family’s architectural advancements and a substantial per-device resource set — 850,000 logic elements, over 71 million bits of on-chip RAM, and 688 I/Os — packaged for industrial-temperature use. This combination makes it well suited for engineers developing high-bandwidth networking, data-center acceleration, and complex protocol or memory-interface applications that require high integration and deterministic operation across a wide temperature range.

Choosing this device provides a path to consolidate system functions into a single high-density FPGA while leveraging family-level innovations such as the Hyperflex core architecture, advanced transceiver capability, and hardened protocol IP to reduce design complexity and accelerate time to market.

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