1SG085HN3F43I3VG

The 1SG085HN3F43I3VG is an Intel Stratix® 10 GX FPGA in a 1760-BBGA (FCBGA) package, supplied as a surface-mount, industrial-grade device. It delivers a large programmable fabric and on-chip memory for high-performance, compute- and I/O-intensive designs.

Built on the Stratix 10 family architecture, the device benefits from family-level innovations such as the Intel Hyperflex™ core architecture and Intel 14 nm tri-gate (FinFET) process, positioning it for applications requiring high logic capacity, substantial on-chip RAM, and dense I/O.

Key Features

• Programmable Fabric  Approximately 850,000 logic elements provide a large, flexible logic resource for complex digital designs.
• On‑Chip Memory  Total embedded RAM of 71,303,168 bits supports large data buffers and state storage directly in the FPGA fabric.
• I/O Density  688 device I/Os enable high channel counts and wide parallel interfaces for system-level integration.
• Family-Level Core & Architecture  Part of the Stratix 10 GX family, which includes the Intel Hyperflex core architecture and Intel 14 nm tri-gate technology for improved core efficiency and performance.
• High‑Speed Transceiver Capability (Family)  Stratix 10 family transceiver technology supports high data‑rate links (family-level capability up to 28.3 Gbps and up to 96 full‑duplex channels).
• DSP and Processing Resources (Family)  Family-level variable precision DSP blocks and hard IP such as PCI Express and Ethernet are part of the Stratix 10 GX/SX device overview.
• Power Supply  Operates from a core voltage supply range of 770 mV to 970 mV to match system power-rail designs.
• Package & Mounting  1760‑BBGA (FCBGA) surface-mount package; supplier device package specified as 1760‑FBGA with 42.5 × 42.5 mm footprint.
• Industrial Temperature Range  Rated for −40 °C to 100 °C operation for deployment in industrial environments.
• Regulatory  RoHS compliant.

Typical Applications

• High‑Bandwidth Networking and Communications  Use the device where dense I/O and family-level high‑speed transceiver capabilities enable multi‑lane links and backplane interfaces.
• Data Center Acceleration  Large logic capacity and abundant on‑chip RAM make the device suitable for hardware acceleration and packet processing functions.
• Advanced Signal Processing  High DSP block capability in the Stratix 10 family supports compute‑intensive signal processing and algorithm acceleration.
• PCI Express and High‑Speed I/O Integration  Designed for systems that require extensive I/O routing and integration with high‑speed interface IP available in the Stratix 10 family.

Unique Advantages

• Large Programmable Capacity:  Approximately 850,000 logic elements provide the headroom needed for complex, multi‑function designs.
• Substantial On‑Chip Memory:  71,303,168 bits of embedded RAM reduce external memory dependence and lower system latency for buffer‑centric tasks.
• High I/O Count:  688 I/Os simplify connectivity to high‑channel peripherals and parallel interfaces without extensive external multiplexing.
• Industrial‑Grade Thermal Range:  Qualified for −40 °C to 100 °C operation, supporting deployment in demanding industrial environments.
• Proven Family Innovations:  Benefits from Stratix 10 family technologies such as the Hyperflex core architecture and 14 nm tri‑gate process for improved core performance and efficiency.
• Compact, High‑Density Package:  1760‑BBGA package with a 42.5 × 42.5 mm footprint balances I/O density and board area for system integration.

Why Choose 1SG085HN3F43I3VG?

The 1SG085HN3F43I3VG delivers a high-capacity Stratix 10 GX FPGA fabric with substantial on‑chip RAM and a large number of I/Os in an industrial-grade, surface-mount BBGA package. It is suited to engineers who need a programmable device that combines high logic capacity, dense I/O, and family-level high‑speed interface capabilities for demanding communications, acceleration, and signal‑processing systems.

Choosing this device provides access to the Stratix 10 family innovations (including Hyperflex architecture and 14 nm FinFET technology) while offering the specific, verifiable electrical and thermal characteristics required for robust system design.

Request a quote or submit an inquiry to obtain pricing, availability, and lead‑time information for the 1SG085HN3F43I3VG.