1SG110HN1F43E2VG

The 1SG110HN1F43E2VG is an Intel Stratix® 10 GX field programmable gate array offered in a 1760-BBGA FCBGA package. It combines very high logic density with large on-chip RAM and a high I/O count for demanding, high-performance designs.

Designed for advanced applications that require large programmable fabric and substantial memory and connectivity, this device leverages Stratix 10 family innovations to deliver system-level integration and efficiency for compute- and bandwidth‑intensive use cases.

Key Features

• Core & architecture (family innovations) Intel Stratix 10 family features including the Intel Hyperflex core architecture and Intel 14 nm tri-gate (FinFET) technology as described in the device family overview.
• Logic capacity 1,100,000 logic elements to implement large-scale digital designs and complex algorithms.
• On-chip memory 112,197,632 total RAM bits for buffering, queuing and local storage of high-throughput data streams.
• I/O and connectivity 688 user I/Os to support dense external interfacing and multiple high‑pin peripherals.
• Power supply Core voltage supply range of 770 mV to 970 mV for the device core.
• Package & mounting 1760-BBGA (1760-FBGA, 42.5 × 42.5 mm supplier package) in a surface-mount form factor for compact, high-pin-count board integration.
• Operating range & grade Extended grade with an operating temperature range of 0 °C to 100 °C.
• Compliance RoHS compliant.

Typical Applications

• High-performance networking Dense logic, large on-chip RAM and high I/O count make this device suitable for packet processing, switch/router front-ends, and line-rate logic implementations.
• Data center acceleration Use as an FPGA accelerator for compute and data-path offload where large logic capacity and memory are required.
• High-speed communications modules High I/O count and family-level transceiver innovations support implementations requiring substantial external connectivity and bandwidth handling.
• Complex digital signal processing Large logic fabric and on-chip memory enable implementation of multi-channel DSP chains and custom data-paths.

Unique Advantages

• High logic density: 1,100,000 logic elements allow integration of large designs on a single device, reducing the need for multi-chip solutions.
• Substantial on-chip RAM: 112,197,632 bits of RAM provide extensive local buffering and memory for high-throughput processing.
• Extensive I/O: 688 I/Os accommodate multiple interfaces and parallel connections without sacrificing board-level flexibility.
• Compact high-pin-count package: 1760-BBGA (42.5 × 42.5 mm) delivers a high-pin solution in a single, surface-mount package for dense PCB layouts.
• Power optimization flexibility: Core voltage range of 770 mV to 970 mV supports designs targeting optimized core power characteristics.
• Extended operating grade: Rated for 0 °C to 100 °C operation, suitable for a wide range of commercial and extended‑temperature environments.

Why Choose 1SG110HN1F43E2VG?

1SG110HN1F43E2VG positions itself for designers who require a high-density FPGA with large on-chip memory and substantial I/O capability in a single-package solution. Its specifications match applications that demand significant programmable logic, extensive buffering, and dense external interfacing.

As a member of the Intel Stratix 10 GX family, this device benefits from family-level architectural innovations and a technology foundation intended for high-performance and high‑bandwidth systems, offering scalability for complex designs and long-term platform consistency.

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