1SG110HN1F43I2LG

The 1SG110HN1F43I2LG is an Intel Stratix® 10 GX Field Programmable Gate Array (FPGA) IC featuring 1,100,000 logic elements and 688 user I/O in a 1760-BBGA (1760-FBGA, 42.5 × 42.5) package. It is built on the Stratix 10 GX family platform, which incorporates the Intel Hyperflex core architecture and Intel 14 nm tri-gate (FinFET) technology to address high-bandwidth, high-performance system requirements.

Engineered for advanced communications, data center, and high-performance signal-processing designs, this device combines large logic and memory resources with high-density I/O and package options suitable for industrial temperature operation.

Key Features

• Core and Logic  1,100,000 logic elements provide a very large programmable logic fabric for complex, compute-intensive designs. The device is part of the Stratix 10 GX family, which leverages the Intel Hyperflex core architecture.
• On‑Chip Memory  112,197,632 total RAM bits enable substantial on-chip buffering and lookup-table memory for real‑time processing and large-state designs. The Stratix 10 family also includes M20K internal SRAM memory block support.
• High‑Density I/O  688 user I/O pins support extensive connectivity and system interfacing in dense designs.
• High‑Speed Transceiver Capability (Family)  As a member of the Stratix 10 GX family, the platform supports heterogeneous transceiver tiles and high-data-rate operation up to family-specified data rates, enabling multi‑gigabit serial connectivity (family-level feature).
• DSP and Compute (Family)  Stratix 10 family variable-precision DSP blocks and floating-point support provide architecture for heavy signal-processing and hardware-acceleration tasks (family-level feature).
• Package and Mounting  1760-BBGA (FCBGA) package, supplier package 1760-FBGA (42.5 × 42.5), designed for surface-mount PCB assembly in compact, high-density systems.
• Power and Thermal  Specified core voltage supply range of 820 mV to 880 mV and an operating temperature range of −40 °C to 100 °C suitable for industrial-grade deployments.
• Configuration and Reliability (Family)  The Stratix 10 family provides device configuration features, secure device management, and fault mitigation capabilities including single event upset detection and correction options (family-level features).
• RoHS Compliant  Device is RoHS compliant.

Typical Applications

• Data Center & Networking  High logic capacity and dense I/O make this device suitable for packet processing, switching, and high-throughput aggregation functions.
• High‑Performance Compute & Acceleration  Large DSP resources and substantial on‑chip memory support hardware acceleration and compute offload in algorithmic and ML inference workflows.
• Telecommunications & Transport  Family-level transceiver capabilities and the device’s logic density enable implementation of multi‑gigabit transport, backplane, and line-card functions.
• Advanced Signal Processing  Extensive RAM and logic resources support real-time filtering, beamforming, and multi-channel digital signal chain implementations.

Unique Advantages

• Highly Scalable Logic Capacity: 1,100,000 logic elements provide the resources needed for large, complex designs without partitioning across multiple devices.
• Substantial On‑Chip Memory: 112,197,632 bits of RAM reduce external memory dependence and improve latency for buffering and stateful algorithms.
• Dense Connectivity: 688 I/O pins in a compact 1760-BBGA package enable high-density board routing and rich peripheral interfacing.
• Industrial Temperature Support: −40 °C to 100 °C operating range supports deployment in industrial environments.
• Platform-Level Performance Enhancements: As part of the Stratix 10 GX family, the device benefits from Hyperflex architecture, FinFET process technology, and family transceiver and DSP innovations.
• Regulatory and Assembly Ready: Surface-mount 1760-FBGA package and RoHS compliance facilitate modern PCB assembly and environmental requirements.

Why Choose 1SG110HN1F43I2LG?

1SG110HN1F43I2LG is positioned for designers who need a high-capacity FPGA with extensive on‑chip memory, dense I/O, and industrial temperature capability. Its integration within the Intel Stratix 10 GX family brings architecture innovations that address demanding bandwidth and processing requirements while enabling complex signal-processing and networking applications.

This device is well suited to engineering teams building scalable, performance-focused systems where logic density, memory footprint, and high-density package options matter for long-term platform development and deployment.

Request a quote or submit an RFQ to obtain pricing and availability information for 1SG110HN1F43I2LG.