1SG110HN1F43E2VGS1

The 1SG110HN1F43E2VGS1 is an Intel Stratix 10 GX field programmable gate array (FPGA) optimized for high-bandwidth, high-performance applications. Built on Intel’s Hyperflex core architecture and 14 nm tri-gate (FinFET) technology as described for the Stratix 10 family, this device targets advanced systems that require large programmable fabric, extensive on-chip memory, and substantial I/O capacity.

This device provides a balance of logic density, embedded memory, and high-speed I/O in a 1760-BBGA FCBGA package, offering solutions for demanding communications, data center, and compute-accelerated designs that require significant programmable resources and integration.

Key Features

• Core Architecture  Intel Hyperflex core architecture and 14 nm tri-gate (FinFET) process technology, delivering the family-level performance and power improvements described for Stratix 10 GX devices.
• Logic Capacity  Approximately 1,100,000 logic elements, enabling large-scale, complex designs in programmable fabric.
• On-Chip Memory  112,197,632 total RAM bits of embedded SRAM to support buffer, cache, and state storage needs directly in the FPGA fabric.
• I/O Density  688 user I/O pins to support wide parallel interfaces and multiple high-speed links.
• High-Speed Transceiver and IP (Family Features)  Stratix 10 family-level capabilities include heterogeneous 3D SiP transceiver tiles and transceiver data rates up to 28.3 Gbps, plus hard IP options such as PCI Express Gen3 x16, 10G Ethernet, and high-rate memory controllers.
• Package and Mounting  1760-BBGA (FCBGA) supplier package, 1760-FBGA (42.5 × 42.5 mm) footprint; surface-mount mounting type for board-level integration.
• Power  Specified voltage supply range of 770 mV to 970 mV.
• Operating Range and Grade  Extended grade with an operating temperature range of 0 °C to 100 °C.
• Regulatory  RoHS compliant.

Typical Applications

• High-Speed Networking & Telecom  Use the device’s high I/O count and family-level high-speed transceiver capabilities for backplane, switch, or packet-processing applications.
• Data Center Acceleration  Large logic capacity and substantial on-chip RAM enable hardware acceleration tasks, buffering, and custom compute kernels for server and acceleration platforms.
• Compute-Intensive Signal Processing  The combination of dense logic and large embedded memory supports complex DSP and processing pipelines for communications and broadcast equipment.
• SoC and Embedded Systems  Stratix 10 family features include embedded processing and hard IP options that facilitate integration of application-class processing and programmable fabric in SoC-style designs.

Unique Advantages

• Large Programmable Fabric:  Approximately 1,100,000 logic elements provide the capacity to implement complex, high-density logic and control functions on a single device.
• Significant On-Chip Memory:  112,197,632 bits of embedded RAM reduce external memory dependence for buffering and state, simplifying system design and improving performance.
• High I/O Count:  688 I/O pins support broad parallel interfaces and multiple simultaneous high-speed links for connectivity-heavy designs.
• Family-Level High-Speed Connectivity:  Access to Stratix 10 GX family transceiver technology and hard IP (PCIe Gen3 x16, 10G Ethernet, DDR4 controllers) enables integration of proven interfaces without external PHYs or controllers.
• Compact, Standard Package:  1760-BBGA (FCBGA) footprint (1760-FBGA, 42.5 × 42.5 mm) supports high-density PCB layouts while remaining surface-mount compatible.
• Controlled Power Envelope:  Specified supply range (770 mV–970 mV) and FinFET process enable power-conscious designs within the listed operating conditions.

Why Choose 1SG110HN1F43E2VGS1?

The 1SG110HN1F43E2VGS1 offers a combination of high logic density, extensive embedded RAM, and substantial I/O capacity in a compact FCBGA package, making it suitable for advanced systems that demand programmable performance and integration. Family-level innovations in the Stratix 10 GX lineup—such as Hyperflex architecture and heterogeneous transceiver tiles—contribute to improved core performance and enabling capabilities for high-bandwidth applications.

This device is appropriate for engineering teams building networking, data center acceleration, and compute-intensive signal-processing solutions who need scalable programmable resources, on-chip memory, and a wide set of interface options within a defined operating voltage and temperature range.

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