1SG085HN3F43I2VG

IC FPGA 688 I/O 1760FBGA
Part Description

Stratix® 10 GX Field Programmable Gate Array (FPGA) IC 688 850000 1760-BBGA, FCBGA

Quantity 256 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package1760-FBGA (42.5x42.5)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1760-BBGA, FCBGANumber of I/O688Voltage770 mV - 970 mV
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs106250Number of Logic Elements/Cells850000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits71303168

Overview of 1SG085HN3F43I2VG – Stratix® 10 GX FPGA, 850000 logic elements, 688 I/O, 1760-FBGA

The Intel Stratix® 10 GX device 1SG085HN3F43I2VG is a high-capacity field programmable gate array (FPGA) packaged in a 1760-FBGA (42.5 × 42.5 mm) surface-mount package. It combines 850,000 logic elements with a broad I/O count and substantial on-chip RAM to address compute- and bandwidth-intensive embedded designs.

Built on the Stratix 10 family architecture, this device targets applications that require high core performance, large memory resources, and flexible I/O, delivered within an industrial-grade operating range and RoHS-compliant manufacturing.

Key Features

  • Core Architecture  Part of the Stratix 10 GX family leveraging the Intel Hyperflex core architecture and Intel 14 nm tri-gate (FinFET) technology, designed to deliver higher core performance per logic element.
  • Logic Capacity  850,000 logic elements provide substantial programmable fabric for complex logic, datapath, and control implementations.
  • On‑Chip Memory  Total RAM of 71,303,168 bits offers extensive embedded SRAM for buffering, look-up tables, and local storage.
  • I/O and Connectivity  688 user I/O pins support dense external interfacing for high-channel-count designs and board-level connectivity.
  • Package and Mounting  1760-FBGA (42.5 × 42.5 mm) surface-mount package provides a high-pin-count, compact footprint suitable for system-level integration.
  • Power and Supply  Supported core voltage range of 770 mV to 970 mV enables compatibility with low-voltage power domains.
  • Environmental and Grade  Industrial grade device with an operating temperature range of −40°C to 100°C and RoHS compliance for regulated manufacturing.
  • Family-Level High-Speed Features  Stratix 10 family innovations include heterogeneous 3D SiP transceiver tiles and high-speed transceiver capability (family data cites transceiver data rates up to 28.3 Gbps), enabling high-bandwidth link options when implemented in system designs.

Typical Applications

  • High‑Performance Networking  Use the high logic count and dense I/O to implement packet processing, switching, and protocol acceleration in network equipment.
  • Telecommunications  Large embedded memory and FPGA fabric support forward error correction, protocol engines, and high‑speed serial links typical in telecom systems.
  • Data Center Acceleration  Deployable for custom acceleration tasks where large programmable logic resources and on‑chip RAM are required for data-path and buffering functions.
  • Advanced Embedded Systems  Industrial temperature rating and extensive I/O make this device suitable for compute-intensive embedded applications requiring robust operation across −40°C to 100°C.

Unique Advantages

  • High Logic Density: 850,000 logic elements enable complex algorithms and large-scale RTL implementations without immediate need for multiple devices.
  • Large On‑Chip RAM: 71,303,168 bits of embedded RAM reduce external memory dependency and lower system latency for buffering and local storage.
  • Extensive I/O Count: 688 I/O pins support high channel counts and flexible board-level interface options.
  • Industrial Temperature Range: Rated from −40°C to 100°C to meet demanding environmental conditions in industrial deployments.
  • Compact, High‑Pin Package: 1760-FBGA (42.5 × 42.5 mm) offers a high-pin-count solution in a compact footprint for dense system integration.
  • Controlled Core Voltage Range: 770 mV to 970 mV compatibility enables integration with modern low-voltage power architectures.

Why Choose 1SG085HN3F43I2VG?

The 1SG085HN3F43I2VG Stratix 10 GX device provides a combination of high logic capacity, large embedded RAM, and a high I/O count in a production-ready industrial-grade package. It suits designers who need substantial programmable resources and on‑chip memory within a compact, surface-mount FBGA footprint.

As part of the Stratix 10 family, this device aligns with an architecture focused on higher core performance and system-level connectivity, offering a scalable path for demanding communications, compute acceleration, and advanced embedded applications while maintaining RoHS compliance.

Request a quote or submit an inquiry to receive pricing, availability, and technical support information for the 1SG085HN3F43I2VG Stratix® 10 GX FPGA.

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