1SG085HN3F43I2VG
| Part Description |
Stratix® 10 GX Field Programmable Gate Array (FPGA) IC 688 850000 1760-BBGA, FCBGA |
|---|---|
| Quantity | 256 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1760-FBGA (42.5x42.5) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1760-BBGA, FCBGA | Number of I/O | 688 | Voltage | 770 mV - 970 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 106250 | Number of Logic Elements/Cells | 850000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 71303168 |
Overview of 1SG085HN3F43I2VG – Stratix® 10 GX FPGA, 850000 logic elements, 688 I/O, 1760-FBGA
The Intel Stratix® 10 GX device 1SG085HN3F43I2VG is a high-capacity field programmable gate array (FPGA) packaged in a 1760-FBGA (42.5 × 42.5 mm) surface-mount package. It combines 850,000 logic elements with a broad I/O count and substantial on-chip RAM to address compute- and bandwidth-intensive embedded designs.
Built on the Stratix 10 family architecture, this device targets applications that require high core performance, large memory resources, and flexible I/O, delivered within an industrial-grade operating range and RoHS-compliant manufacturing.
Key Features
- Core Architecture Part of the Stratix 10 GX family leveraging the Intel Hyperflex core architecture and Intel 14 nm tri-gate (FinFET) technology, designed to deliver higher core performance per logic element.
- Logic Capacity 850,000 logic elements provide substantial programmable fabric for complex logic, datapath, and control implementations.
- On‑Chip Memory Total RAM of 71,303,168 bits offers extensive embedded SRAM for buffering, look-up tables, and local storage.
- I/O and Connectivity 688 user I/O pins support dense external interfacing for high-channel-count designs and board-level connectivity.
- Package and Mounting 1760-FBGA (42.5 × 42.5 mm) surface-mount package provides a high-pin-count, compact footprint suitable for system-level integration.
- Power and Supply Supported core voltage range of 770 mV to 970 mV enables compatibility with low-voltage power domains.
- Environmental and Grade Industrial grade device with an operating temperature range of −40°C to 100°C and RoHS compliance for regulated manufacturing.
- Family-Level High-Speed Features Stratix 10 family innovations include heterogeneous 3D SiP transceiver tiles and high-speed transceiver capability (family data cites transceiver data rates up to 28.3 Gbps), enabling high-bandwidth link options when implemented in system designs.
Typical Applications
- High‑Performance Networking Use the high logic count and dense I/O to implement packet processing, switching, and protocol acceleration in network equipment.
- Telecommunications Large embedded memory and FPGA fabric support forward error correction, protocol engines, and high‑speed serial links typical in telecom systems.
- Data Center Acceleration Deployable for custom acceleration tasks where large programmable logic resources and on‑chip RAM are required for data-path and buffering functions.
- Advanced Embedded Systems Industrial temperature rating and extensive I/O make this device suitable for compute-intensive embedded applications requiring robust operation across −40°C to 100°C.
Unique Advantages
- High Logic Density: 850,000 logic elements enable complex algorithms and large-scale RTL implementations without immediate need for multiple devices.
- Large On‑Chip RAM: 71,303,168 bits of embedded RAM reduce external memory dependency and lower system latency for buffering and local storage.
- Extensive I/O Count: 688 I/O pins support high channel counts and flexible board-level interface options.
- Industrial Temperature Range: Rated from −40°C to 100°C to meet demanding environmental conditions in industrial deployments.
- Compact, High‑Pin Package: 1760-FBGA (42.5 × 42.5 mm) offers a high-pin-count solution in a compact footprint for dense system integration.
- Controlled Core Voltage Range: 770 mV to 970 mV compatibility enables integration with modern low-voltage power architectures.
Why Choose 1SG085HN3F43I2VG?
The 1SG085HN3F43I2VG Stratix 10 GX device provides a combination of high logic capacity, large embedded RAM, and a high I/O count in a production-ready industrial-grade package. It suits designers who need substantial programmable resources and on‑chip memory within a compact, surface-mount FBGA footprint.
As part of the Stratix 10 family, this device aligns with an architecture focused on higher core performance and system-level connectivity, offering a scalable path for demanding communications, compute acceleration, and advanced embedded applications while maintaining RoHS compliance.
Request a quote or submit an inquiry to receive pricing, availability, and technical support information for the 1SG085HN3F43I2VG Stratix® 10 GX FPGA.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018