1SG085HN3F43E2VGAS
| Part Description |
Stratix® 10 GX Field Programmable Gate Array (FPGA) IC 688 850000 1760-BBGA, FCBGA |
|---|---|
| Quantity | 967 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1760-FBGA (42.5x42.5) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1760-BBGA, FCBGA | Number of I/O | 688 | Voltage | 770 mV - 970 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 106250 | Number of Logic Elements/Cells | 850000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 71303168 |
Overview of 1SG085HN3F43E2VGAS – Stratix® 10 GX FPGA, 1760-BBGA (1760-FBGA 42.5×42.5)
The 1SG085HN3F43E2VGAS is an Intel Stratix® 10 GX Field Programmable Gate Array supplied in a 1760-BBGA FCBGA package. It combines high logic capacity, substantial on-chip memory and a large I/O count for demanding, compute- and bandwidth-intensive FPGA designs.
Built on the Stratix 10 GX family architecture, this device targets applications that require high integration density and flexible system integration while operating across a 0 °C to 100 °C range and an extended-grade classification.
Key Features
- Core Architecture Stratix 10 GX family innovations such as the Intel Hyperflex core architecture are referenced in the device overview, delivering improved core performance and power efficiency at the family level.
- Logic Capacity 850,000 logic elements provide substantial programmable fabric for complex logic, control and datapath implementations.
- On-Chip Memory 71,303,168 total RAM bits of embedded memory to support large buffers, FIFOs and on-chip data storage.
- I/O Resources 688 I/O pins enable extensive peripheral, memory and high-density interface routing for system integration.
- Package & Mounting 1760-BBGA (1760-FBGA, 42.5 × 42.5 mm) surface-mount package for high-pin-count board designs and dense system layouts.
- Power Core supply operating range 770 mV to 970 mV, enabling designers to plan power delivery for the device core accurately.
- Operating Conditions & Grade Extended-grade device rated for 0 °C to 100 °C operation and RoHS compliant for environmental standards.
- Family-Level I/O & Transceiver Capabilities The Stratix 10 GX family documentation highlights advanced transceiver and high-speed interface capabilities (family-level features referenced in the datasheet).
Typical Applications
- High-Speed Networking Use the device where dense logic, large on-chip memory and extensive I/O are required to implement packet processing, switching or custom line-rate functions.
- Data Center Acceleration Suitable for hardware acceleration tasks that need significant programmable fabric and memory for parallel processing and buffering.
- High-Performance Signal Processing Large logic and memory resources support complex DSP pipelines and variable-precision algorithms referenced by the Stratix 10 family overview.
- Advanced System Integration High I/O count and the 1760-FBGA package make it a fit for systems that consolidate multiple interfaces and on-board controllers into a single FPGA device.
Unique Advantages
- High Logic Density: 850,000 logic elements give designers headroom for complex custom logic and large-scale state machines.
- Large On-Chip Memory: Over 71 million bits of embedded RAM reduce external memory dependence for many buffering and storage tasks.
- Extensive I/O: 688 I/O pins support multi-channel interfaces and flexible board-level partitioning.
- Compact, High-Pin Package: 1760-FBGA (42.5 × 42.5 mm) surface-mount package balances pin count with board footprint for dense designs.
- Configurable Power Profile: Core voltage range of 770 mV to 970 mV helps designers align power delivery and thermal planning with system requirements.
- Extended Grade and RoHS Compliance: Extended-grade operating range and RoHS compliance support deployment in applications requiring these specific qualifications.
Why Choose 1SG085HN3F43E2VGAS?
This Stratix 10 GX device brings a combination of large programmable fabric, significant embedded memory and a substantial I/O complement in a high-pin-count FBGA package. It is positioned for designers who need a highly integrated FPGA platform from the Stratix 10 family to implement compute- and bandwidth-intensive functions while managing board space and system complexity.
Customers designing high-performance networking, acceleration or signal-processing systems will benefit from the device's logic density, memory capacity and family-level architectural innovations documented in the Stratix 10 GX overview.
Request a quote or contact sales to discuss pricing, availability and how 1SG085HN3F43E2VGAS fits your next high-performance FPGA design.

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