1SG085HN3F43E1VG

The 1SG085HN3F43E1VG is an Intel Stratix® 10 GX field programmable gate array (FPGA) in a 1760‑BBGA FCBGA package. It combines a high logic capacity with abundant on‑chip memory and I/O to address high‑bandwidth, compute‑intensive designs.

Built on the Stratix 10 GX architecture family, this device is designed for advanced communications, compute acceleration and high‑performance system applications where large logic counts, extensive on‑chip RAM and a high I/O count are required.

Key Features

• Logic Capacity – 850,000 logic elements providing substantial programmable fabric for complex designs and algorithm implementation.
• On‑chip Memory – 71,303,168 total RAM bits to support large buffering, lookup tables and on‑chip data storage.
• I/O Density – 688 I/Os to enable multi‑lane, multi‑module and high‑pin‑count interface requirements.
• Stratix 10 GX Architecture – Based on the Intel Stratix 10 GX device family architecture and design innovations described in the device overview.
• Power Supply Range – Core voltage supply from 770 mV to 970 mV for operation within the specified power envelope.
• Package & Mounting – 1760‑BBGA (1760‑FBGA supplier package, 42.5 × 42.5 mm) in a surface‑mount FCBGA format for system PCB integration.
• Temperature & Grade – Extended grade with an operating temperature range of 0 °C to 100 °C for applications requiring broader thermal tolerance.
• Compliance – RoHS compliant for regulatory adherence in standard commercial/industrial deployments.

Typical Applications

• High‑performance Networking & Telecom – Use the device’s high logic density and extensive I/O to implement multi‑lane packet processing, protocol engines and backplane interfaces.
• Data Center Acceleration – Implement compute‑intensive kernels and custom accelerators that benefit from large on‑chip RAM and substantial logic resources.
• Test & Measurement Systems – Leverage the abundant I/O and memory to handle multi‑channel data capture, preprocessing and real‑time analysis.
• High‑speed Communications Modules – Integrate into modules and systems requiring many I/Os and significant programmable logic for multi‑protocol support and signal processing.

Unique Advantages

• High programmable capacity: 850,000 logic elements enable complex, large‑scale designs without immediate need for multi‑device partitioning.
• Large on‑chip memory: Over 71 million bits of RAM reduce external memory dependence and lower system latency for data‑intensive tasks.
• Extensive I/O count: 688 I/Os simplify board‑level routing for multiport systems and high‑channel count applications.
• Robust package option: 1760‑BBGA (42.5 × 42.5 mm) FCBGA provides a high‑pin‑count, surface‑mount solution suitable for dense system boards.
• Extended thermal grade: Rated 0 °C to 100 °C to support deployments with elevated ambient temperatures within the specified range.
• Standards‑aware compliance: RoHS conformity supports regulatory requirements for many commercial and industrial designs.

Why Choose 1SG085HN3F43E1VG?

The 1SG085HN3F43E1VG positions itself as a high‑capacity Stratix 10 GX FPGA option for designs that demand large programmable fabric, significant on‑chip RAM and a high I/O count in a compact FCBGA package. Its extended temperature grade and RoHS compliance make it suitable for demanding commercial and industrial applications within the specified ranges.

This part is appropriate for engineering teams developing advanced communications, data‑center acceleration, high‑speed measurement and other compute‑heavy systems that require scalability, integration and the architecture benefits of the Stratix 10 GX family.

Please submit a request for a quote or sales inquiry to receive pricing, availability and lead‑time information for 1SG085HN3F43E1VG. Technical sales support can provide configuration guidance and ordering options tailored to your project needs.