1SG085HN2F43E1VG

The 1SG085HN2F43E1VG is an Intel Stratix® 10 GX family FPGA in a 1760-BBGA FCBGA package. It combines the Stratix 10 Hyperflex core architecture and Intel 14 nm tri-gate technology (family-level features) with device-level resources to address high-bandwidth, high-performance applications.

With 850,000 logic elements, 71,303,168 bits of on-chip RAM and 688 I/O, this extended-grade, surface-mount FPGA targets advanced communications, compute acceleration and signal-processing designs that require large fabric capacity and extensive connectivity.

Key Features

• Core and architecture  Intel Stratix 10 Hyperflex core architecture and Intel 14 nm tri-gate (FinFET) technology are highlighted in the Stratix 10 family documentation to deliver increased core performance.
• Logic capacity  850,000 logic elements to implement complex digital designs and large programmable fabrics.
• On-chip memory  71,303,168 total RAM bits of internal memory; the family description references M20K SRAM memory blocks for embedded storage.
• DSP and compute  Family-level variable precision DSP blocks and hard floating-point/fixed-point capability are provided in Stratix 10 documentation to support high-throughput signal processing workloads.
• I/O and connectivity  688 I/O pins for broad external interfacing; Stratix 10 family materials reference high-performance transceivers and hard IP (for example PCI Express and Ethernet) in the device family.
• Package and mounting  1760-BBGA FCBGA surface-mount package (supplier device package: 1760-FBGA, 42.5 × 42.5 mm) for high-pin-count board designs.
• Power and operating range  Supported core supply range 770 mV to 970 mV; operating temperature range 0 °C to 100 °C. Device is specified as Extended grade.
• Environmental compliance  RoHS compliant.

Typical Applications

• High-speed networking and switching  Uses the device's large logic capacity and extensive I/O to implement packet processing, forwarding and network fabric functions.
• Data center acceleration  Leverages abundant logic elements, on-chip memory and family-level DSP capabilities for compute offload and low-latency data-paths.
• High-performance signal processing  Supports complex filtering, FFTs and other DSP algorithms using the device's memory and DSP resources described in Stratix 10 documentation.
• PCIe and protocol bridging  Suited to systems requiring high-throughput protocol interfaces and extensive external connectivity using the device's I/O resources and family hard IP features.

Unique Advantages

• High logic density: 850,000 logic elements provide the capacity needed for large-scale FPGA implementations.
• Substantial on-chip memory: 71,303,168 total RAM bits reduce dependence on external memory for many workloads.
• Extensive I/O: 688 I/O pins and a 1760-ball FCBGA package support complex, high-pin-count board designs.
• Family-level performance innovations: Stratix 10 Hyperflex core architecture and 14 nm tri-gate technology (documented at the family level) drive improved core performance and efficiency.
• Design-grade operating range: Extended-grade device with 0 °C to 100 °C operating temperature and a 770 mV–970 mV core supply window for system integration flexibility.
• Regulatory/environmental compliance: RoHS compliant to meet common environmental requirements.

Why Choose 1SG085HN2F43E1VG?

The 1SG085HN2F43E1VG delivers a combination of high logic capacity, large on-chip memory and broad I/O in a high-pin-count FCBGA package—positioning it for demanding communications, compute acceleration and signal-processing applications. As an Extended-grade Stratix 10 GX device, it brings family-level architecture innovations to designs that require significant programmable fabric and connectivity.

Choose this part when your design requires scalable Stratix 10 family capabilities, substantial on-chip resources and the physical interface density afforded by a 1760-ball FCBGA package.

Request a quote or submit an inquiry for pricing and availability to move your design forward with 1SG085HN2F43E1VG.