1SG085HN1F43I2LGAS

The 1SG085HN1F43I2LGAS is an Intel Stratix® 10 GX Field Programmable Gate Array (FPGA) in a 1760-BBGA FCBGA package. It delivers high logic capacity and on-chip memory for demanding, bandwidth- and compute-intensive embedded designs.

Built on the Stratix 10 family architecture, this device leverages the Intel Hyperflex core innovations and Intel 14 nm tri-gate (FinFET) technology to provide improved core performance and power efficiency for applications requiring large logic arrays, abundant I/O, and industrial operating range.

Key Features

• Logic Capacity  850,000 logic elements provide substantial programmable logic for complex designs and high-density integration.
• On-Chip Memory  71,303,168 bits of total RAM support large buffering, packet processing, and data-path storage requirements.
• I/O and Packaging  688 I/O pins in a 1760-FBGA (42.5 × 42.5 mm) surface-mount package enable wide parallel interfaces and dense board-level connectivity.
• Power and Supply  Core voltage support from 820 mV to 880 mV enables compatibility with low-voltage power domains.
• Operating Range  Industrial temperature rating from −40 °C to 100 °C suitable for embedded and industrial environments.
• Intel Stratix 10 Family Innovations  Includes Intel Hyperflex core architecture and 14 nm tri-gate (FinFET) process technologies as described in the Stratix 10 GX family overview.
• Mounting and Compliance  Surface-mount FCBGA package; RoHS compliant.

Typical Applications

• High-performance packet processing  Large logic array and abundant on-chip RAM support deep packet inspection, traffic shaping, and protocol offload functions.
• Networking and telecommunications  High I/O count and Stratix 10 family transceiver capabilities (as described in the device overview) suit backplane and high-bandwidth line cards.
• Data center acceleration  Dense logic and memory resources enable custom accelerators, compression, and encryption engines where throughput and determinism matter.
• Industrial control and automation  Industrial temperature rating and robust packaging make the device appropriate for embedded controllers and industrial instrumentation.

Unique Advantages

• High logic density: 850,000 logic elements allow consolidation of complex subsystems onto a single device.
• Substantial on-chip RAM: 71,303,168 bits of RAM reduce external memory dependence and improve data-path latency.
• Large, flexible I/O: 688 I/Os in a 1760-FBGA (42.5 × 42.5 mm) footprint supports wide parallel interfaces and dense board routing.
• Industrial temperature support: −40 °C to 100 °C rating enables use in harsh or temperature-variable environments.
• Low core voltage operation: 820–880 mV supply compatibility aligns with modern low-voltage power architectures.
• RoHS compliant: Environmentally compliant manufacturing and material profile.

Why Choose 1SG085HN1F43I2LGAS?

The 1SG085HN1F43I2LGAS combines a large programmable fabric, extensive on-chip RAM, and high I/O density in a single industrial-grade FPG A package. Its placement in the Stratix 10 GX family brings architecture-level innovations aimed at improving core performance and power efficiency for demanding designs.

This device is well suited for engineers and system designers building high-throughput, compute-intensive solutions—where consolidating functionality, meeting industrial temperature requirements, and leveraging a high-density package are priorities. The combination of logic capacity, memory, and I/O scalability delivers long-term design headroom and integration potential.

Request a quote or submit an inquiry today to discuss availability, lead times, and pricing for the 1SG085HN1F43I2LGAS Stratix® 10 GX FPGA.