1SG085HN1F43I2VG

IC FPGA 688 I/O 1760FBGA
Part Description

Stratix® 10 GX Field Programmable Gate Array (FPGA) IC 688 850000 1760-BBGA, FCBGA

Quantity 1,592 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package1760-FBGA (42.5x42.5)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1760-BBGA, FCBGANumber of I/O688Voltage770 mV - 970 mV
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs106250Number of Logic Elements/Cells850000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits71303168

Overview of 1SG085HN1F43I2VG – Stratix® 10 GX Field Programmable Gate Array (FPGA) IC 688 850000 1760-BBGA, FCBGA

The 1SG085HN1F43I2VG is an Intel Stratix 10 GX FPGA device providing a high-density, high-performance programmable fabric for advanced digital designs. Built on the Stratix 10 family and Hyperflex core architecture, the device targets applications requiring large logic capacity, extensive on-chip memory, and high-speed I/O connectivity.

Key value propositions include substantial logic resources and embedded RAM for complex algorithms, broad I/O count for system interfacing, and industrial-grade operating range and packaging for demanding deployments.

Key Features

  • Logic Capacity  The device provides 850,000 logic elements to implement large custom logic, control and datapath functions.
  • On-Chip Memory  71,303,168 total RAM bits of embedded memory to support buffering, state storage and memory-intensive algorithms.
  • Logic-Array Blocks  106,250 logic-array blocks (LABs) enabling structured resource allocation across designs.
  • I/O Density  688 user I/Os for extensive system-level interfacing and parallel connectivity.
  • Advanced Family Architecture  Based on the Stratix 10 GX family with Intel Hyperflex core architecture, delivering improved core performance and efficiency as described in the device overview.
  • High-speed Transceiver and System Features (Family)  Stratix 10 family innovations include heterogeneous 3D SiP transceiver tiles, high-rate transceivers and hard IP for high-bandwidth serial protocols (as described in the device overview).
  • Package and Mounting  1760-BBGA FCBGA surface-mount package (1760-FBGA, 42.5 × 42.5 mm) for dense board integration.
  • Power  Core supply range 770 mV to 970 mV to match system power architectures.
  • Operating Range  Industrial temperature rating from −40 °C to 100 °C for deployment in temperature-challenging environments.
  • Compliance  RoHS compliant.

Typical Applications

  • High-performance networking  Implement packet processing, line-rate switching and protocol offload using large logic capacity and high-speed transceiver features in the Stratix 10 family.
  • Telecommunications and backplane systems  Use the device’s extensive I/O and family transceiver capabilities to build backplane interfaces and multi‑lane serial links.
  • Compute acceleration  Deploy algorithms and fixed- or floating-point processing in the fabric and on-chip memory for data-center acceleration tasks.
  • Signal processing and RF front-ends  Leverage high RAM capacity and large logic resources for filtering, buffering and real-time DSP pipelines.

Unique Advantages

  • Large, integrated programmable fabric: 850,000 logic elements and over 71 million RAM bits enable complex system-on-FPGA implementations without extensive external memory.
  • High I/O count: 688 user I/Os provide flexible board-level interfacing for dense systems and multi-channel designs.
  • Industrial operating range: −40 °C to 100 °C rating supports deployment in thermally demanding environments.
  • Compact, high-density package: 1760-BBGA FCBGA (42.5 × 42.5 mm) allows high-pin-count integration in space-constrained PCBs.
  • Optimized core supply window: 770 mV–970 mV core voltage range aligns with low-voltage system power rails for modern designs.
  • Standards-conscious compliance: RoHS compliance eases integration into products requiring restricted-substance conformity.

Why Choose 1SG085HN1F43I2VG?

The 1SG085HN1F43I2VG positions itself as a high-density Stratix 10 GX device that combines substantial logic and embedded memory resources with a high I/O count and industrial temperature rating. It is suited to designers and system integrators building bandwidth- and compute-intensive applications that need a programmable, scalable platform.

As part of the Stratix 10 family, this device benefits from the family-level innovations and architecture described in the official device overview, offering a clear upgrade path for designs that require expanded logic, memory and transceiver capabilities.

Request a quote or submit a procurement inquiry to evaluate 1SG085HN1F43I2VG for your next high-performance FPGA design project.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up