1SG085HN1F43I2VG
| Part Description |
Stratix® 10 GX Field Programmable Gate Array (FPGA) IC 688 850000 1760-BBGA, FCBGA |
|---|---|
| Quantity | 1,592 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1760-FBGA (42.5x42.5) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1760-BBGA, FCBGA | Number of I/O | 688 | Voltage | 770 mV - 970 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 106250 | Number of Logic Elements/Cells | 850000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 71303168 |
Overview of 1SG085HN1F43I2VG – Stratix® 10 GX Field Programmable Gate Array (FPGA) IC 688 850000 1760-BBGA, FCBGA
The 1SG085HN1F43I2VG is an Intel Stratix 10 GX FPGA device providing a high-density, high-performance programmable fabric for advanced digital designs. Built on the Stratix 10 family and Hyperflex core architecture, the device targets applications requiring large logic capacity, extensive on-chip memory, and high-speed I/O connectivity.
Key value propositions include substantial logic resources and embedded RAM for complex algorithms, broad I/O count for system interfacing, and industrial-grade operating range and packaging for demanding deployments.
Key Features
- Logic Capacity The device provides 850,000 logic elements to implement large custom logic, control and datapath functions.
- On-Chip Memory 71,303,168 total RAM bits of embedded memory to support buffering, state storage and memory-intensive algorithms.
- Logic-Array Blocks 106,250 logic-array blocks (LABs) enabling structured resource allocation across designs.
- I/O Density 688 user I/Os for extensive system-level interfacing and parallel connectivity.
- Advanced Family Architecture Based on the Stratix 10 GX family with Intel Hyperflex core architecture, delivering improved core performance and efficiency as described in the device overview.
- High-speed Transceiver and System Features (Family) Stratix 10 family innovations include heterogeneous 3D SiP transceiver tiles, high-rate transceivers and hard IP for high-bandwidth serial protocols (as described in the device overview).
- Package and Mounting 1760-BBGA FCBGA surface-mount package (1760-FBGA, 42.5 × 42.5 mm) for dense board integration.
- Power Core supply range 770 mV to 970 mV to match system power architectures.
- Operating Range Industrial temperature rating from −40 °C to 100 °C for deployment in temperature-challenging environments.
- Compliance RoHS compliant.
Typical Applications
- High-performance networking Implement packet processing, line-rate switching and protocol offload using large logic capacity and high-speed transceiver features in the Stratix 10 family.
- Telecommunications and backplane systems Use the device’s extensive I/O and family transceiver capabilities to build backplane interfaces and multi‑lane serial links.
- Compute acceleration Deploy algorithms and fixed- or floating-point processing in the fabric and on-chip memory for data-center acceleration tasks.
- Signal processing and RF front-ends Leverage high RAM capacity and large logic resources for filtering, buffering and real-time DSP pipelines.
Unique Advantages
- Large, integrated programmable fabric: 850,000 logic elements and over 71 million RAM bits enable complex system-on-FPGA implementations without extensive external memory.
- High I/O count: 688 user I/Os provide flexible board-level interfacing for dense systems and multi-channel designs.
- Industrial operating range: −40 °C to 100 °C rating supports deployment in thermally demanding environments.
- Compact, high-density package: 1760-BBGA FCBGA (42.5 × 42.5 mm) allows high-pin-count integration in space-constrained PCBs.
- Optimized core supply window: 770 mV–970 mV core voltage range aligns with low-voltage system power rails for modern designs.
- Standards-conscious compliance: RoHS compliance eases integration into products requiring restricted-substance conformity.
Why Choose 1SG085HN1F43I2VG?
The 1SG085HN1F43I2VG positions itself as a high-density Stratix 10 GX device that combines substantial logic and embedded memory resources with a high I/O count and industrial temperature rating. It is suited to designers and system integrators building bandwidth- and compute-intensive applications that need a programmable, scalable platform.
As part of the Stratix 10 family, this device benefits from the family-level innovations and architecture described in the official device overview, offering a clear upgrade path for designs that require expanded logic, memory and transceiver capabilities.
Request a quote or submit a procurement inquiry to evaluate 1SG085HN1F43I2VG for your next high-performance FPGA design project.

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