1SG085HN1F43I2VGAS

The 1SG085HN1F43I2VGAS is an Intel Stratix 10 GX family FPGA in a 1760-BBGA (1760-FBGA, 42.5×42.5) package. It combines high logic density, large on-chip memory, and extensive I/O to support demanding bandwidth and compute tasks in industrial environments.

Built on Stratix 10 family innovations (including the Intel Hyperflex core architecture and Intel 14 nm tri-gate technology), this device addresses applications that require substantial logic resources, high I/O counts, and robust thermal and voltage operating ranges.

Key Features

• Logic Capacity — 850,000 logic elements for complex digital designs and high-density logic implementation.
• On‑Chip Memory — 71,303,168 total RAM bits to support large buffering, lookup tables, and memory-intensive functions.
• I/O Count — 688 I/Os to interface with multiple high-speed peripherals, memory systems, and system buses.
• Package — 1760-BBGA (1760-FBGA, 42.5×42.5) surface-mount package for high-density board integration.
• Power and Voltage — Core voltage supply range of 770 mV to 970 mV to match low-voltage system domains.
• Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C for deployed industrial and embedded systems.
• Family-Level Innovations — Stratix 10 family features cited in the device overview include the Intel Hyperflex core architecture and Intel 14 nm tri‑gate (FinFET) technology, delivering improved core performance and power characteristics at the family level.
• Compliance — RoHS compliant.

Typical Applications

• High‑Performance Networking — Use the large logic capacity and extensive I/O to implement packet processing, switching logic, and protocol acceleration where dense logic and many I/Os are required.
• Data Center Acceleration — Deploy as a compute acceleration fabric for offload engines and data-path processing that benefit from substantial on‑chip RAM and logic resources.
• Telecommunications and Backplane Systems — Support high-bandwidth transceiver and PHY integration in systems that demand robust interfacing and industrial temperature operation.
• Signal Processing and DSP — Implement high‑throughput DSP pipelines and buffering using the device’s large RAM and logic resources for communications and instrumentation tasks.

Unique Advantages

• High logic density: 850,000 logic elements enabling integration of complex state machines, datapaths, and control logic in a single device.
• Substantial on‑chip memory: Over 71 million bits of RAM for large buffers, FIFOs, and table storage without immediate external memory dependence.
• Extensive I/O capacity: 688 I/Os to accommodate multiple parallel interfaces, memory channels, and system connections.
• Industrial temperature range: −40 °C to 100 °C rating for reliable operation in temperature-challenging deployments.
• Compact high‑density package: 1760-FBGA (42.5×42.5) package supports high pin counts while enabling efficient PCB layout for dense system designs.
• Low-voltage core domain: 770 mV to 970 mV supply range suited for modern low-voltage system architectures.

Why Choose 1SG085HN1F43I2VGAS?

This Stratix 10 GX FPGA combines significant logic capacity, large on‑chip RAM, and a high I/O count in a compact 1760-FBGA package, making it suitable for engineers designing bandwidth‑intensive, compute‑heavy industrial systems. The device leverages Stratix 10 family innovations such as the Hyperflex core architecture and Intel 14 nm tri‑gate technology as described in the device overview to deliver the family’s performance and power characteristics.

Choose 1SG085HN1F43I2VGAS for designs that require dense logic implementation, substantial local memory, flexible interfacing, and industrial-temperature operation—providing a scalable FPGA option within the Stratix 10 family for demanding embedded and system-level applications.

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