1SG085HN1F43I1VGAS

The 1SG085HN1F43I1VGAS is an Intel Stratix® 10 GX field programmable gate array (FPGA) IC provided in a 1760‑BBGA (1760‑FBGA) package. This industrial‑grade device combines high logic density with large on‑chip RAM and extensive I/O to address demanding, high‑performance applications.

As a member of the Stratix® 10 GX family, the device is built around the family’s advanced architecture and platform innovations, delivering the performance and integration needed for high‑bandwidth and compute‑intensive systems while supporting industrial operating conditions.

Key Features

• Logic Capacity — 850,000 logic elements for complex digital designs and large-scale logic integration.
• On‑Chip Memory — 71,303,168 total RAM bits to support buffering, look‑up tables, and embedded data storage.
• I/O Density — 688 user I/O pins to accommodate a wide variety of interfaces and high pin‑count systems.
• Package & Mounting — 1760‑BBGA (1760‑FBGA) package, 42.5 × 42.5 mm footprint; surface mount for board‑level integration.
• Power Supply — Core voltage range 770 mV to 970 mV to match system power budgets and core rail requirements.
• Industrial Temperature Range — Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
• Family Innovations (Stratix® 10 GX) — Family‑level features include the Intel Hyperflex core architecture and Intel 14 nm tri‑gate process technology, delivering performance and power efficiency improvements across the platform.
• Compliance — RoHS‑compliant device meeting common environmental requirements for electronic components.

Typical Applications

• High‑Performance Networking — Implement packet processing, protocol offload, and aggregation logic using abundant logic elements and high I/O counts.
• Data Center Acceleration — Support compute acceleration, buffering, and custom compute pipelines leveraging large on‑chip RAM and dense logic resources.
• Telecommunications & Backplane Systems — Use the device’s high I/O density and family transceiver capabilities for high‑bandwidth serial links and backplane interfaces.
• Industrial Control & Automation — Deploy in industrial systems that require an extended temperature range and robust logic integration for control, timing, and I/O aggregation.

Unique Advantages

• High logic density: 850,000 logic elements enable complex FPGA designs without external logic expansion.
• Substantial on‑chip memory: Over 71 million bits of RAM reduce reliance on external memory for many buffering and caching needs.
• Extensive I/O: 688 I/O pins provide flexibility to interface with multiple peripherals, lanes, and high‑speed front‑ends.
• Industrial temperature rating: −40 °C to 100 °C supports deployment in temperature‑challenging environments.
• Compact high‑pin package: 1760‑BBGA (42.5 × 42.5 mm) combines high I/O count with a surface‑mount form factor suitable for dense board designs.
• Family‑level performance features: Benefits from the Stratix® 10 GX platform innovations such as the Intel Hyperflex core architecture and 14 nm tri‑gate technology.

Why Choose 1SG085HN1F43I1VGAS?

This Stratix® 10 GX FPGA delivers a balance of high logic capacity, large embedded RAM, and substantial I/O in a single industrial‑grade package—making it well suited for high‑bandwidth, compute‑intensive, and industrial applications. Its platform heritage brings family‑level architectural advantages that support demanding designs while maintaining efficient power and thermal profiles through a low core voltage range.

Designers and system integrators seeking a scalable, high‑density FPGA with industrial temperature capability will find the 1SG085HN1F43I1VGAS appropriate for complex prototyping, deployment, and long‑lifecycle applications where integration, performance, and robustness are priorities.

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