1SG085HN1F43E2LG

The 1SG085HN1F43E2LG is an Intel Stratix® 10 GX high-performance FPGA in a 1760‑FBGA (42.5 × 42.5 mm) package. It delivers a large programmable fabric with 850,000 logic elements and extensive on-chip RAM for demanding processing and bandwidth-oriented applications.

Built on the Stratix 10 family architecture, this device targets advanced applications that require high logic capacity, substantial I/O (688 pins), and optimized power characteristics. The device benefits from family-level innovations including the Intel Hyperflex core architecture and 14 nm process technology to increase core performance and efficiency.

Key Features

• Logic Capacity – 850,000 logic elements provide substantial programmable fabric to implement large-scale custom logic, protocol stacks, and complex state machines.
• Embedded Memory – 71,303,168 total RAM bits enable large on-chip buffering, lookup tables, and data storage for high-throughput designs.
• I/O and Package – 688 user I/O pins in a 1760-BBGA (1760-FBGA, 42.5 × 42.5 mm) package, delivered as a surface-mount FCBGA for board-level integration.
• Core Architecture – Stratix 10 family innovations such as the Intel Hyperflex core architecture and 14 nm FinFET technology provide the family-level improvements in core performance and power efficiency referenced in the device overview.
• Power Supply – Core voltage supply range of 820 mV to 880 mV for integration with regulated power domains.
• Operating Range & Grade – Extended grade device with an operating temperature range of 0 °C to 100 °C for demanding system environments.
• Mounting and Compliance – Surface-mount FCBGA package and RoHS compliance for standard manufacturing flows.

Typical Applications

• High‑Performance Networking – Implement packet processing, protocol offload, and high-bandwidth forwarding engines using large logic and memory resources.
• Data Center Acceleration – Deploy custom accelerators and data-path engines that leverage extensive on-chip RAM and dense logic capacity for throughput-sensitive workloads.
• Communications Infrastructure – Support line-card and module designs requiring many I/O pins and large programmable fabric for multi-protocol handling.
• Advanced Signal Processing – Implement complex DSP pipelines and buffering using the device’s large logic and memory resources for real-time processing tasks.

Unique Advantages

• High Logic Density: 850,000 logic elements provide the capacity to consolidate multiple functions into a single device and reduce system complexity.
• Large On‑Chip Memory: Over 71 million RAM bits enable deep buffering and stateful processing without immediate reliance on external memory.
• Extensive I/O Count: 688 I/O pins support wide parallel interfaces, numerous peripherals, and complex board partitioning.
• Family-Level Performance Enhancements: Stratix 10 family innovations such as the Hyperflex architecture and 14 nm process contribute to increased core performance and efficiency for compute-intensive designs.
• Compact, Surface-Mount Packaging: 1760-FBGA (42.5 × 42.5 mm) provides a high pin-count solution suitable for dense PCB layouts.
• Regulated Core Voltage: Narrow core voltage range (820–880 mV) allows predictable power integration into regulated multi-rail systems.

Why Choose 1SG085HN1F43E2LG?

This Stratix 10 GX device is positioned for designers who need a high-capacity, I/O-rich FPGA with substantial on-chip RAM and family-level architecture improvements aimed at boosting performance and efficiency. Its extended grade temperature range and surface-mount FCBGA package make it suitable for systems where board-level integration and robust thermal design are required.

Choose this device for projects that demand consolidation of complex logic, high-throughput data paths, or extensive I/O connectivity while leveraging the Stratix 10 family innovations for improved core performance and power characteristics.

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