1SG065HH3F35I3XG

The 1SG065HH3F35I3XG is an Intel Stratix® 10 GX field programmable gate array (FPGA) supplied in a 1152-BBGA FCBGA package. It provides substantial on-chip resources for complex digital designs, with a focus on high logic and memory capacity and extensive external interfacing.

With 612,000 logic elements, 51,380,224 total RAM bits and 392 I/O pins, this industrial-grade, RoHS-compliant device operates from a 820 mV to 880 mV core supply and supports an operating temperature range of −40°C to 100°C, making it suitable for demanding, high-density and I/O-intensive applications.

Key Features

• Logic Capacity 612,000 logic elements to implement large-scale digital functions and complex processing blocks.
• On-chip Memory 51,380,224 total RAM bits for buffering, lookup tables and embedded data storage.
• I/O Density 392 I/O pins to support extensive external interfacing and multi-channel connectivity.
• Package and Mounting 1152-BBGA (FCBGA) package; supplier device package 1152-FBGA (35×35), designed for surface-mount PCB assembly.
• Power Supply Core voltage supply range of 820 mV to 880 mV.
• Temperature Range Industrial operating range from −40°C to 100°C for deployment in challenging environments.
• Compliance RoHS compliant for material and regulatory considerations.

Typical Applications

• High-density digital processing Use the large logic element count and on-chip RAM to implement complex processing pipelines and custom accelerators.
• I/O-rich systems Leverage 392 I/O pins to connect multiple peripherals, sensors, or external interfaces in multi-channel systems.
• Industrial control and automation Industrial-grade temperature tolerance and surface-mount packaging make the device suitable for robust embedded control applications.

Unique Advantages

• High logic and memory density: 612,000 logic elements plus over 51 million RAM bits reduce reliance on external components and simplify board-level architecture.
• Extensive external interfacing: 392 I/O pins enable flexible, high-pin-count designs for complex system integration.
• Compact, production-ready package: 1152-BBGA (35×35) FCBGA and surface-mount mounting support compact PCB layouts and automated assembly processes.
• Industrial temperature tolerance: −40°C to 100°C operation supports deployment in harsh or temperature-variable environments.
• Low core voltage operation: 820–880 mV supply range aligns with low-voltage core domains for power-conscious designs.
• Regulatory compliance: RoHS compliance helps streamline material selection and procurement.

Why Choose 1SG065HH3F35I3XG?

The 1SG065HH3F35I3XG combines substantial logic capacity, large on-chip memory and high I/O pin count in an industrial-temperature, RoHS-compliant FCBGA package. These attributes make it well suited to engineers building high-density, I/O-intensive systems that require robust operation across a wide temperature range.

By integrating large amounts of logic and RAM on-chip, the device helps reduce external component counts and supports scalable designs where processing density and interface flexibility are priorities.

Request a quote for 1SG065HH3F35I3XG to evaluate pricing and availability for your next design or submit a quote request through your preferred procurement channel.