1SG065HH3F35I2LG

The 1SG065HH3F35I2LG is a Stratix® 10 GX Field Programmable Gate Array (FPGA) IC designed for high-density, performance-oriented programmable logic implementations. It integrates 612,000 logic elements and 51,380,224 bits of on-chip RAM to support complex digital processing and large-scale gate designs.

Engineered for industrial-grade deployments, this surface-mount FCBGA device provides up to 392 I/Os, a compact 1152-BBGA package, and an operating temperature range of −40°C to 100°C, enabling use in systems that require durable, high-capacity programmable logic.

Key Features

• Core Logic  612,000 logic elements provide high logic density for complex designs and large-scale parallel processing.
• On-chip Memory  51,380,224 total RAM bits support extensive buffering, caching, and state storage for data-intensive applications.
• I/O Capacity  392 general-purpose I/Os accommodate broad interfacing needs for sensors, peripherals, and external logic.
• Power Supply  Operates from 820 mV–880 mV supply rails as specified for the device.
• Package & Mounting  1152-BBGA (FCBGA) package with supplier package listed as 1152-FBGA (35×35); surface-mount mounting type simplifies PCB integration.
• Thermal & Grade  Industrial-grade device rated for operation from −40°C to 100°C for reliable performance in demanding environments.
• Compliance  RoHS compliant.

Typical Applications

• Industrial Control Systems  Use the device’s industrial temperature range and high logic density to implement complex control algorithms and real-time processing.
• High-Density Logic and Acceleration  Leverage 612,000 logic elements and large on-chip RAM for hardware acceleration, signal processing, and custom compute engines.
• Embedded System Integration  392 I/Os and a compact FCBGA package enable integration with sensors, peripherals, and external memory in embedded platforms.

Unique Advantages

• Significant Logic Capacity: 612,000 logic elements enable implementation of large, complex designs without partitioning across multiple devices.
• Substantial On-Chip Memory: 51,380,224 bits of RAM reduce external memory dependencies and improve data locality for performance-sensitive functions.
• Industrial Temperature Range: Rated from −40°C to 100°C to support reliable operation in harsh or temperature-variable environments.
• High I/O Count: 392 I/Os provide flexibility for broad connectivity and system interfacing requirements.
• Compact, Surface-Mount Package: 1152-BBGA (FCBGA) package and surface-mount mounting simplify PCB layout for space-constrained designs.
• Regulatory Compliance: RoHS compliance supports environmentally responsible deployments.

Why Choose 1SG065HH3F35I2LG?

The 1SG065HH3F35I2LG positions itself as a high-density, industrial-grade FPGA option for designs that require substantial logic resources and on-chip memory within a compact FCBGA package. Its combination of 612,000 logic elements, over 51 million bits of RAM, and 392 I/Os makes it suitable for developers building complex processing pipelines, hardware accelerators, and robust embedded systems.

Choose this Stratix® 10 GX device when you need scalable programmable logic with industrial temperature capability and a surface-mount BGA footprint that integrates into modern system designs while maintaining compliance with RoHS requirements.

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