1SG065HH3F35E3XG

The 1SG065HH3F35E3XG is an Intel Stratix® 10 GX Field Programmable Gate Array (FPGA) in a 1152-BBGA FCBGA package. It delivers high logic capacity, large on-chip memory, and a high I/O count for demanding programmable-logic designs.

With 612,000 logic elements, more than 51 million bits of on-chip RAM, and 392 I/O pins, this device targets systems that require dense logic integration, significant on-chip memory, and substantial I/O bandwidth while operating within an 0 °C to 100 °C extended-grade temperature range.

Key Features

• Logic Capacity  612,000 logic elements provide large programmable fabric for complex digital designs and custom hardware acceleration.
• On‑Chip Memory  Total RAM of 51,380,224 bits supports data buffering, lookup tables, and memory-intensive algorithms directly on the FPGA.
• I/O Count  392 I/O pins accommodate dense peripheral connectivity and wide external interfaces for data ingress/egress.
• Package  1152‑BBGA (FCBGA), supplier package listed as 1152‑FBGA (35×35), optimized for surface-mount assembly and high-pin-count routing.
• Power  Core voltage supply range from 820 mV to 880 mV allows designers to plan power delivery and thermal budgets precisely.
• Operating Range  Extended grade with an operating temperature range of 0 °C to 100 °C for a wide set of deployment environments.
• Mounting  Surface-mount device suitable for modern PCB assembly processes.
• Compliance  RoHS compliant for environmental and regulatory considerations.

Typical Applications

• High‑density compute and acceleration  Use the large logic fabric and abundant on-chip RAM to implement custom accelerators and data-path pipelines.
• Network and telecom equipment  Support high-throughput packet processing and interface aggregation with extensive I/O and programmable logic.
• Signal processing and instrumentation  Implement real-time processing, filtering, and buffering with large RAM and dense logic resources.
• Storage and data center systems  Enable protocol offload, data compression, and control functions where on-chip memory and logic density reduce external component count.

Unique Advantages

• High logic density: 612,000 logic elements enable integration of complex functions into a single device, reducing board-level component count.
• Substantial on‑chip memory: 51,380,224 bits of RAM provide local storage for buffering and state, improving system latency and throughput.
• Extensive I/O capability: 392 I/O pins support multiple external interfaces and parallel data paths without immediate need for I/O expansion.
• Compact, high‑pin package: 1152‑BBGA FCBGA offers dense connectivity in a surface-mount form factor suitable for high-performance PCBs.
• Extended operating range: 0 °C to 100 °C grade supports a wide array of deployment environments while maintaining device specifications.
• Regulatory readiness: RoHS compliance simplifies integration into environmentally regulated product lines.

Why Choose 1SG065HH3F35E3XG?

The 1SG065HH3F35E3XG positions itself as a high-capacity Stratix® 10 GX FPGA option for designs that require dense programmable logic, significant on-chip RAM, and a high I/O count in a compact BGA footprint. Its specified core voltage range and extended temperature grade give engineers the parameters needed to design reliable power and thermal solutions.

This device is well suited to system designers building compute- and I/O-intensive equipment who need to consolidate functions into a single programmable device. Choosing this FPGA supports long-term design scalability through large logic and memory resources while adhering to RoHS environmental requirements.

Request a quote or submit a purchase inquiry to obtain pricing and availability for the 1SG065HH3F35E3XG Stratix® 10 GX FPGA. Include your required quantity and delivery timeline to receive a tailored response.