1SG065HH3F35I3VG

The 1SG065HH3F35I3VG is an Intel Stratix® 10 GX field programmable gate array (FPGA) supplied in a 1152-BBGA (35×35) FCBGA package. It provides high logic capacity, large on-chip RAM, and extensive I/O for complex, high-density FPGA implementations.

Engineered for industrial applications, this device combines 612,000 logic elements, 51,380,224 bits of embedded RAM, and 392 I/O signals while operating from a 770 mV to 970 mV supply and across an operating temperature range of −40 °C to 100 °C.

Key Features

• Core / Logic — 612,000 logic elements to implement large-scale digital logic, parallel compute, and custom acceleration functions.
• On-chip Memory — 51,380,224 bits of total RAM for buffering, local data storage, and low-latency memory requirements.
• I/O Capacity — 392 user I/O pins to support multiple interfaces, channel counts, and peripheral connectivity.
• Power — Core voltage supply range from 770 mV to 970 mV to match low-voltage system rails and power domains.
• Package & Mounting — 1152-BBGA FCBGA (supplier package 1152-FBGA, 35×35) in a surface-mount form factor for compact board integration.
• Temperature & Grade — Industrial grade with specified operating range of −40 °C to 100 °C for deployment in temperature-challenging environments.
• Compliance — RoHS compliant, meeting common environmental and manufacturing requirements.

Typical Applications

• High-density logic designs — Implement complex state machines, parallel datapaths, and custom compute pipelines using 612,000 logic elements.
• Memory-intensive functions — Use 51,380,224 bits of embedded RAM for large buffering, packet queues, or on-chip dataset storage.
• I/O-rich systems — Leverage 392 I/O signals to interface with multiple high-channel peripherals, sensors, or external logic blocks.

Unique Advantages

• High logic capacity: 612,000 logic elements enable consolidation of complex functions into a single device, reducing BOM and board-level integration.
• Large on-chip RAM: Over 51 million bits of RAM reduces dependence on external memory for many buffering and caching tasks, improving latency and system compactness.
• Extensive I/O: 392 I/O pins support diverse connectivity needs, simplifying board routing for multi-interface designs.
• Compact, manufacturable package: 1152-BBGA (35×35) surface-mount package provides a dense footprint suitable for space-constrained PCBs.
• Industrial temperature range: −40 °C to 100 °C operation supports deployment in environments with wide thermal variation.
• Low-voltage core compatibility: 770 mV–970 mV supply range aligns with low-voltage power architectures to help optimize system power.

Why Choose 1SG065HH3F35I3VG?

The 1SG065HH3F35I3VG positions itself as a high-capacity, industrial-grade FPGA option for designs that require substantial logic resources, large on-chip memory, and broad I/O connectivity in a compact package. Its electrical and thermal specifications support integration into systems with low-voltage cores and broad operating-temperature requirements.

This device is well suited to engineers and teams seeking a single, densely populated FPGA to consolidate functionality, reduce external memory needs, and maintain manufacturable board layouts while meeting industrial environmental ranges.

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