1SG065HH3F35I2VG

The 1SG065HH3F35I2VG is a Stratix® 10 GX Field Programmable Gate Array (FPGA) IC from Intel supplied in a 1152-BBGA (35×35) package. It provides a high-density programmable fabric with a large embedded memory footprint and a substantial I/O count for complex digital designs.

With 612,000 logic elements, 51,380,224 total RAM bits and 392 I/Os, this industrial-grade FPGA supports designs that require significant logic capacity, on-chip memory and extensive interfacing while operating across a wide industrial temperature range.

Key Features

• Core Logic 612,000 logic elements for high-density programmable logic implementations.
• Embedded Memory 51,380,224 total RAM bits to support large on-chip data storage and buffering needs.
• I/O Capacity 392 I/Os to accommodate wide parallel interfaces and multiple external peripherals.
• Package & Mounting 1152-BBGA, FCBGA (1152-FBGA, 35×35) supplier package in a surface-mount form factor for compact board-level integration.
• Power Voltage supply range from 770 mV to 970 mV to match system power-rail requirements.
• Operating Range & Grade Industrial grade with an operating temperature range of −40 °C to 100 °C for use in thermally demanding environments.
• Regulatory RoHS compliant.

Typical Applications

• High-density logic implementations — Designs that require large programmable fabric capacity, leveraging 612,000 logic elements for complex control and processing tasks.
• On-chip data buffering and storage — Systems needing substantial embedded memory for packet buffering, frame storage or intermediate data processing using 51,380,224 RAM bits.
• Multi-interface systems — Applications requiring many external connections or parallel interfaces using up to 392 I/Os.
• Industrial embedded systems — Deployments that benefit from industrial-grade temperature support (−40 °C to 100 °C) and surface-mount BGA packaging for rugged board designs.

Unique Advantages

• High logic density: 612,000 logic elements enable consolidation of complex functions into a single device, reducing board-level component count.
• Large on-chip memory: Over 51 million RAM bits support extensive buffering and local data handling without external memory dependence.
• Extensive I/O: 392 I/Os provide flexibility to connect multiple peripherals, sensors, or high-pin-count interfaces directly to the FPGA.
• Industrial temperature capability: Rated from −40 °C to 100 °C for reliable operation in demanding thermal conditions.
• Compact BGA packaging: 1152-BBGA (35×35) surface-mount package balances pin count and board space for dense system integration.
• RoHS compliance: Meets lead-free and restricted-substance requirements for regulated manufacturing environments.

Why Choose 1SG065HH3F35I2VG?

The 1SG065HH3F35I2VG positions itself as a high-capacity, industrial-grade FPGA platform that combines a large logic fabric, substantial embedded memory and a high I/O count in a compact 1152-BBGA package. These attributes make it suitable for engineers seeking to integrate complex digital functions and extensive data handling into a single programmable device.

This device is well suited to teams building scalable, robust embedded systems where on-chip resources and industrial temperature operation are key selection criteria. Its combination of logic, memory and I/O simplifies system architecture and supports long-term design flexibility.

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