1SG065HH3F35E3VG

The 1SG065HH3F35E3VG is a Stratix® 10 GX field programmable gate array (FPGA) in a 1152-BBGA (FCBGA) package. It delivers a high-density programmable logic fabric with 612,000 logic elements and 51,380,224 bits of on-chip RAM, designed for designs that require significant logic capacity, large memory resources, and extensive I/O connectivity.

Supplied in a surface-mount 1152-FBGA (35×35) package with an operating voltage range of 770 mV to 970 mV and an operating temperature range of 0 °C to 100 °C (Extended grade), this device targets systems that need high integration and scalable programmable resources.

Key Features

• High-density Logic — 612,000 logic elements provide significant programmable fabric for complex logic, custom datapaths, and large-scale designs.
• Core Logic Blocks — 76,500 CLBs (configurable logic blocks) enable structured implementation of large designs and modular logic partitioning.
• On-chip Memory — 51,380,224 total RAM bits to support buffering, large lookup tables, and on-FPGA data storage without external memory for many functions.
• Extensive I/O — 392 I/O pins to support multiple interfaces, parallel buses, and mixed-signal front-ends requiring many connections.
• Power Envelope — Operates from 770 mV to 970 mV, enabling designs that require low-voltage core power domains.
• Package & Mounting — 1152-BBGA (FCBGA) / 1152-FBGA (35×35) surface-mount package for high-density PCB integration.
• Extended Temperature Grade — Specified for 0 °C to 100 °C operation to suit a range of commercial and industrial ambient conditions.
• Regulatory Compliance — RoHS compliant.

Typical Applications

• High-density signal processing — Use the large logic element count and ample on-chip RAM for complex FIR/IIR filtering, FFTs, and real-time data manipulation.
• Data acquisition and buffering — Leverage the substantial RAM bits and numerous I/O for multi-channel data capture, buffering, and pre-processing before host transfer.
• Protocol bridging and I/O aggregation — 392 I/O pins support consolidation of diverse interfaces, enabling protocol conversion and aggregation in compact hardware.

Unique Advantages

• Significant programmable capacity: 612,000 logic elements enable large, feature-rich designs without immediate need for external logic expansion.
• Large on-chip memory: Over 51 million RAM bits reduce dependency on external memory for many buffering and caching tasks, simplifying board-level design.
• Broad I/O support: 392 I/O pins allow flexible connectivity options for multi-channel systems and high-pin-count interfaces.
• Compact, manufacturable package: 1152-FBGA (35×35) surface-mount package supports dense PCB layouts while maintaining robust signal routing.
• Extended operating range: 0 °C to 100 °C specification and RoHS compliance support deployment in a wide range of environments and meet common regulatory requirements.

Why Choose 1SG065HH3F35E3VG?

The 1SG065HH3F35E3VG positions itself as a high-capacity, highly integrated FPGA option for designs demanding substantial logic, memory, and I/O resources in a single device. Its combination of 612,000 logic elements, 51,380,224 RAM bits, and 392 I/Os makes it suitable for engineers building complex signal-processing, data-acquisition, and multi-interface systems.

With a compact 1152-FBGA (35×35) surface-mount package, a low-voltage core supply range, and an extended operating temperature window, this device offers a balance of integration and robustness for demanding board-level implementations where on-chip resources and pin count are key design drivers.

Request a quote or submit an inquiry to learn about availability, pricing, and lead times for the 1SG065HH3F35E3VG.