1SG065HH3F35E1VG

The 1SG065HH3F35E1VG is a Stratix® 10 GX Field Programmable Gate Array (FPGA) in a 1152-BBGA FCBGA package. It provides a high-density programmable fabric with 612,000 logic elements and 51,380,224 bits of on-chip RAM, alongside 392 I/O connections for complex system integration.

Engineered for designs that require large logic capacity, substantial embedded memory, and a broad I/O complement, this device operates from a 770 mV to 970 mV supply and supports an operating temperature range of 0 °C to 100 °C. The device is RoHS compliant and specified as Extended grade.

Key Features

• Logic Capacity — 612,000 logic elements to support large, complex digital designs and parallel processing architectures.
• Embedded Memory — 51,380,224 total RAM bits for on-chip buffering, large state machines, and data storage without external memory.
• I/O Resources — 392 I/O pins to interface with multiple peripherals, sensors, and external devices in dense systems.
• Power Supply Range — Operates from 770 mV to 970 mV, enabling compatibility with low-voltage FPGA power rails and system power domains.
• Package and Mounting — 1152-BBGA (1152-FBGA, 35×35 supply package) in a surface-mount form factor for compact board layouts.
• Temperature and Grade — Extended grade device specified for 0 °C to 100 °C operation to meet typical commercial and extended-environment requirements.
• Regulatory — RoHS compliant.

Typical Applications

• High-density digital processing: Implement compute-heavy algorithms and custom datapaths using 612,000 logic elements and abundant on-chip RAM.
• I/O‑intensive systems: Integrate multiple external interfaces and peripherals leveraging 392 general-purpose I/O pins.
• On-chip buffering and memory tasks: Use 51,380,224 bits of embedded RAM for large FIFO buffers, frame storage, and temporary data retention without external memory.
• Space-constrained PCB designs: Deploy the device in compact, surface-mount 1152-BBGA packaging to save board area while retaining high resource counts.

Unique Advantages

• High logic density: 612,000 logic elements enable implementation of complex state machines, custom datapaths, and wide parallelism on a single device.
• Substantial on-chip RAM: Over 51 million bits of embedded RAM reduce dependence on external memory and simplify system memory architecture.
• Broad I/O complement: 392 I/O pins provide flexibility for multi-channel interfaces, sensor arrays, and mixed-signal front ends.
• Compact, production-ready package: 1152-BBGA (35×35) surface-mount package supports compact PCB layouts for dense system designs.
• Extended-grade operation: Specified for 0 °C to 100 °C, suitable for deployments requiring extended commercial temperature range.
• RoHS compliant: Meets common environmental compliance requirements for modern electronics manufacturing.

Why Choose 1SG065HH3F35E1VG?

This Stratix® 10 GX FPGA delivers a combination of high logic capacity, large embedded RAM, and extensive I/O in a compact FCBGA package, making it well suited for designs that demand significant on-chip resources and dense integration. Its supply voltage window and extended-grade temperature specification make it appropriate for a wide range of commercial and extended-environment applications.

Ideal for engineering teams building complex digital systems that require scalable logic, substantial on-chip memory, and flexible interfacing, the 1SG065HH3F35E1VG provides a verifiable resource profile to inform system architecture and BOM decisions while maintaining RoHS compliance.

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