1SG065HH2F35I1VG

The 1SG065HH2F35I1VG is a Stratix® 10 GX field programmable gate array (FPGA) IC designed for high-density, industrial-grade applications. It integrates a large logic fabric and on-chip memory in a compact 1152-BBGA FCBGA package for board-level, surface-mount deployment.

With 612,000 logic elements, over 51 million bits of on-chip RAM, and 392 I/O, this device targets designs that require extensive programmable logic, significant embedded memory, and substantial external connectivity while operating across a wide industrial temperature range.

Key Features

• Logic Capacity — 612,000 logic elements provide a high-density programmable fabric suitable for large, complex designs.
• On-Chip Memory — Total RAM of 51,380,224 bits supports sizeable embedded data storage and buffering within the FPGA.
• I/O — 392 general-purpose I/O pins enable broad interfacing to peripherals, high-speed links, and board-level signals.
• Power — Supported supply voltage range from 770 mV to 970 mV, enabling compatibility with core power domains used in advanced FPGA systems.
• Package & Mounting — 1152-BBGA (FCBGA) surface-mount package; supplier device package listed as 1152-FBGA (35×35) for compact, high-pin-count board integration.
• Operating Range — Industrial-grade operation from −40 °C to 100 °C for use in temperature-challenging environments.
• Regulatory Status — RoHS compliant.

Typical Applications

• Industrial Control Systems — Use the device where robust logic capacity and industrial temperature operation are required for machine control, motor drives, and process automation.
• High-Density Logic Implementations — Deploy for complex, large-scale programmable logic tasks that demand extensive logic elements and embedded RAM.
• Systems with Extensive I/O — Ideal for designs that require broad external connectivity or multiple parallel interfaces thanks to 392 I/O pins.
• Compact Board-Level Integration — The 1152-BBGA (35×35) package supports high-pin-count designs in space-constrained layouts.

Unique Advantages

• High Logic Scale: 612,000 logic elements let you implement large, complex digital functions without external programmable logic.
• Large Embedded Memory: 51,380,224 bits of on-chip RAM reduce dependence on external memory for buffering and data processing.
• Extensive I/O Count: 392 I/O pins enable flexible system interfacing and parallel connectivity options.
• Industrial Temperature Rating: Specified operation from −40 °C to 100 °C supports deployment in harsh or temperature-variable environments.
• Compact High-Pin Package: 1152-BBGA (1152-FBGA, 35×35) allows dense signal routing and integration on modern PCBs.
• RoHS Compliant: Conforms to RoHS requirements for environmental compliance in manufactured products.

Why Choose 1SG065HH2F35I1VG?

1SG065HH2F35I1VG positions itself as a high-capacity Stratix® 10 GX FPGA option that balances extensive logic resources, significant on-chip memory, and a large I/O complement within a compact FCBGA package. Its industrial temperature rating and surface-mount 1152-BBGA form factor make it suitable for demanding embedded systems and board-level deployments that require durable, high-density programmable logic.

This device is well suited for engineers and design teams implementing large-scale programmable designs that demand integrated memory, substantial connectivity, and consistent operation across a wide temperature range. The combination of logic, memory, I/O, and packaging supports scalable designs and long-term deployment in industrial environments.

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