1SG065HH1F35I2VG

The 1SG065HH1F35I2VG is a Stratix® 10 GX field programmable gate array (FPGA) IC designed for demanding programmable-logic designs. The device integrates a large logic fabric and on-chip memory to support complex, high-density digital implementations.

With 612,000 logic elements, 51,380,224 total RAM bits and 392 I/Os in a 1152-ball FCBGA package, this industrial-grade FPGA targets applications that require substantial programmable logic capacity, extensive on-chip memory and broad I/O connectivity while operating across an industrial temperature range and a defined core voltage window.

Key Features

• Logic Capacity — 612,000 logic elements provide large programmable logic resources for complex designs and parallel processing architectures.
• On-Chip Memory — 51,380,224 total RAM bits enable extensive buffering, packet storage or algorithmic memory requirements without immediate external memory dependence.
• I/O Count — 392 I/Os allow broad external interfacing for peripherals, high-density connectors or multi-channel signal routing.
• Power and Core Voltage — Supports a core voltage supply range of 770 mV to 970 mV, allowing designers to plan power delivery and sequencing within the specified window.
• Package and Mounting — Supplied in a 1152-BBGA, FCBGA package (supplier device package: 1152-FBGA 35×35) for surface-mount PCB assembly and compact board-level integration.
• Industrial Temperature Range — Rated for operation from −40 °C to 100 °C to meet industrial environmental requirements.
• RoHS Compliant — Conforms to RoHS requirements for materials compliance.

Unique Advantages

• Substantial Logic Density: 612,000 logic elements provide the capacity to implement large state machines, datapaths and parallel compute blocks on a single device, reducing the need for multiple FPGAs.
• Large Embedded Memory: 51,380,224 RAM bits support significant on-chip data storage, lowering external memory bandwidth requirements and simplifying board-level BOM.
• High I/O Count: 392 I/Os give flexibility for multi-interface designs, allowing direct connections to a wide range of peripherals and signals.
• Industrial Reliability: Rated for −40 °C to 100 °C operation, suitable for industrial deployments where extended temperature range is required.
• Compact FCBGA Package: The 1152-ball FBGA (35×35) package enables high-density board layouts while supporting surface-mount assembly processes.
• Standards-Compliant Materials: RoHS compliance supports regulatory and environmental requirements for component selection.

Why Choose 1SG065HH1F35I2VG?

The 1SG065HH1F35I2VG combines large programmable logic resources, extensive on-chip memory and a broad I/O count in a compact FCBGA package rated for industrial temperatures. This makes it appropriate for designs that demand high logic capacity and significant embedded RAM while maintaining a compact board footprint and surface-mount assembly.

Engineers and procurement teams looking for a scalable, robust FPGA solution will find this device suitable for industrial applications that require verified operating temperature and voltage windows, RoHS-compliant materials, and a high-density package option. Manufacturer documentation is available for detailed integration and electrical guidance.

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