1SG065HH2F35E1VG

The 1SG065HH2F35E1VG is a Stratix® 10 GX field programmable gate array (FPGA) from Intel, offered in a 1152-ball FCBGA package. It delivers high logic capacity and large on-chip memory with a configuration targeted for complex, high-density digital designs.

Key attributes include a large count of logic elements, substantial embedded RAM, dense I/O, extended grade qualification, and support for low-voltage core operation—all in a surface-mount FCBGA footprint.

Key Features

• Core Logic  612,000 logic elements provide substantial programmable logic resources for complex processing and custom hardware acceleration.
• Configurable Logic Blocks  76,500 configurable logic blocks (LABs) for structural resource planning and partitioning of large designs.
• On‑Chip Memory  51,380,224 total RAM bits to support buffering, large data sets, and on‑chip storage for high-throughput designs.
• I/O Density  392 I/O pins enable extensive connectivity to peripherals, high-speed interfaces, and board-level routing options.
• Power  Core voltage supply range from 770 mV to 970 mV for low-voltage operation planning and power budgeting.
• Package & Mounting  1152-ball FCBGA (35 × 35 mm) surface-mount package for compact, board-level integration.
• Temperature & Grade  Extended grade with an operating temperature range of 0 °C to 100 °C for reliable operation in elevated ambient conditions.
• Compliance  RoHS compliant to support lead‑free assembly and regulatory requirements.

Unique Advantages

• High logic capacity: 612,000 logic elements allow implementation of large state machines, custom accelerators, and parallel datapaths without immediate need for external logic.
• Large embedded memory: Over 51 million RAM bits reduce dependence on external memory for buffering and intermediate data storage, simplifying PCB design.
• Dense connectivity: 392 I/O pins support multiple interfaces and high pin-count designs within a single device footprint.
• Compact FCBGA package: 1152-ball 35 × 35 mm package balances high device density with a compact board area for space-constrained designs.
• Low-voltage operation: 770 mV–970 mV supply range helps designers manage core power and thermal profiles in power-sensitive applications.
• Extended grade reliability: Rated for 0 °C to 100 °C operation to support deployment in environments with elevated ambient temperatures.

Why Choose 1SG065HH2F35E1VG?

The 1SG065HH2F35E1VG combines large-scale programmable logic, extensive on-chip RAM, and substantial I/O in a compact FCBGA package, positioning it for designs that require high integration and scalability. Its extended grade rating and RoHS compliance add practical reliability and manufacturing compatibility.

Backed by Intel's Stratix® 10 GX family heritage, this device is suitable for designers who need significant programmable resources, dense connectivity, and controlled power characteristics, offering a clear path for complex digital systems and long-term deployment.

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