1SG065HH2F35I2LG

IC FPGA STRATIX10GX 1152FBGA
Part Description

Stratix® 10 GX Field Programmable Gate Array (FPGA) IC 392 51380224 612000 1152-BBGA, FCBGA

Quantity 457 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O392Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs76500Number of Logic Elements/Cells612000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits51380224

Overview of 1SG065HH2F35I2LG – Stratix® 10 GX Field Programmable Gate Array (FPGA) IC, 612000 logic elements, 392 I/Os, 1152-BBGA FCBGA

The 1SG065HH2F35I2LG is a Stratix® 10 GX Field Programmable Gate Array (FPGA) IC designed for high-density programmable logic and on-chip memory integration. It provides 612000 logic elements and 51,380,224 total RAM bits, delivering significant resource capacity in a single device.

Built for industrial use, this surface-mount FCBGA device features 392 I/Os, a 1152-BBGA (35×35) package, a core voltage supply range of 820 mV to 880 mV, and an operating temperature range of −40 °C to 100 °C, enabling deployment in temperature-demanding environments.

Key Features

  • Core Logic  Contains 612000 logic elements, offering high logic density for complex programmable designs.
  • On-Chip Memory  Provides 51,380,224 total RAM bits for large buffering, data storage, and state retention within the FPGA fabric.
  • I/O Count  Includes 392 input/output pins to support a wide range of external interfaces and parallel connectivity.
  • Package & Mounting  Supplied in a 1152-BBGA, FCBGA package (1152-FBGA, 35×35) for compact, high-density board integration; surface-mount mounting type.
  • Power  Core voltage supply range is 820 mV to 880 mV, enabling precise power design and supply selection.
  • Industrial Grade Temperature  Rated for operation from −40 °C to 100 °C, supporting deployment in industrial temperature environments.
  • Environmental Compliance  RoHS compliant.

Unique Advantages

  • High logic capacity: 612000 logic elements enable implementation of large-scale, complex designs without partitioning across multiple devices.
  • Extensive on-chip memory: 51,380,224 RAM bits reduce reliance on external memory and simplify data buffering and processing workflows.
  • Large I/O complement: 392 I/Os provide flexibility for interfacing with a variety of external devices, sensors, and high-speed interfaces.
  • Industrial temperature range: −40 °C to 100 °C rating supports reliable operation in temperature-challenging installations.
  • Compact, production-ready package: 1152-BBGA FCBGA (35×35) form factor enables high-density PCB layouts with surface-mount assembly.
  • Controlled core voltage: 820 mV to 880 mV supply window allows deterministic power design for the FPGA core.

Why Choose 1SG065HH2F35I2LG?

This Stratix® 10 GX FPGA packs substantial logic and memory resources into a single industrial-grade FCBGA package, making it suitable for designs that require high integration and robust temperature performance. Its combination of 612000 logic elements, over 51 million RAM bits, and 392 I/Os supports complex, resource-intensive implementations while simplifying system architecture.

Choose 1SG065HH2F35I2LG when your design demands high on-chip capacity, a broad I/O complement, and industrial temperature tolerance. The device’s package and power characteristics support compact, production-oriented board designs and predictable power budgeting.

Request a quote or submit a sales inquiry to begin procurement or to get detailed ordering and availability information for 1SG065HH2F35I2LG.

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