1SG065HH2F35I2LG
| Part Description |
Stratix® 10 GX Field Programmable Gate Array (FPGA) IC 392 51380224 612000 1152-BBGA, FCBGA |
|---|---|
| Quantity | 457 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 392 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 76500 | Number of Logic Elements/Cells | 612000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 51380224 |
Overview of 1SG065HH2F35I2LG – Stratix® 10 GX Field Programmable Gate Array (FPGA) IC, 612000 logic elements, 392 I/Os, 1152-BBGA FCBGA
The 1SG065HH2F35I2LG is a Stratix® 10 GX Field Programmable Gate Array (FPGA) IC designed for high-density programmable logic and on-chip memory integration. It provides 612000 logic elements and 51,380,224 total RAM bits, delivering significant resource capacity in a single device.
Built for industrial use, this surface-mount FCBGA device features 392 I/Os, a 1152-BBGA (35×35) package, a core voltage supply range of 820 mV to 880 mV, and an operating temperature range of −40 °C to 100 °C, enabling deployment in temperature-demanding environments.
Key Features
- Core Logic Contains 612000 logic elements, offering high logic density for complex programmable designs.
- On-Chip Memory Provides 51,380,224 total RAM bits for large buffering, data storage, and state retention within the FPGA fabric.
- I/O Count Includes 392 input/output pins to support a wide range of external interfaces and parallel connectivity.
- Package & Mounting Supplied in a 1152-BBGA, FCBGA package (1152-FBGA, 35×35) for compact, high-density board integration; surface-mount mounting type.
- Power Core voltage supply range is 820 mV to 880 mV, enabling precise power design and supply selection.
- Industrial Grade Temperature Rated for operation from −40 °C to 100 °C, supporting deployment in industrial temperature environments.
- Environmental Compliance RoHS compliant.
Unique Advantages
- High logic capacity: 612000 logic elements enable implementation of large-scale, complex designs without partitioning across multiple devices.
- Extensive on-chip memory: 51,380,224 RAM bits reduce reliance on external memory and simplify data buffering and processing workflows.
- Large I/O complement: 392 I/Os provide flexibility for interfacing with a variety of external devices, sensors, and high-speed interfaces.
- Industrial temperature range: −40 °C to 100 °C rating supports reliable operation in temperature-challenging installations.
- Compact, production-ready package: 1152-BBGA FCBGA (35×35) form factor enables high-density PCB layouts with surface-mount assembly.
- Controlled core voltage: 820 mV to 880 mV supply window allows deterministic power design for the FPGA core.
Why Choose 1SG065HH2F35I2LG?
This Stratix® 10 GX FPGA packs substantial logic and memory resources into a single industrial-grade FCBGA package, making it suitable for designs that require high integration and robust temperature performance. Its combination of 612000 logic elements, over 51 million RAM bits, and 392 I/Os supports complex, resource-intensive implementations while simplifying system architecture.
Choose 1SG065HH2F35I2LG when your design demands high on-chip capacity, a broad I/O complement, and industrial temperature tolerance. The device’s package and power characteristics support compact, production-oriented board designs and predictable power budgeting.
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