1SG065HH2F35E2LG

The 1SG065HH2F35E2LG is a Stratix® 10 GX Field Programmable Gate Array (FPGA) IC provided in a 1152-BBGA FCBGA package. It delivers high logic capacity and extensive on-chip RAM for designs that require substantial programmable logic and memory integration.

With a broad I/O count and a controlled supply voltage range, this device supports complex, memory-intensive digital designs within an extended operating temperature range.

Key Features

• Core Logic  Approximately 612,000 logic elements to implement large-scale programmable logic and complex processing pipelines.
• Embedded Memory  51,380,224 total RAM bits for on-chip buffering, state storage, and memory-intensive functions that reduce external memory requirements.
• I/O Density  392 general-purpose I/O pins to support wide parallel interfaces and multiple peripheral connections.
• Package and Mounting  1152-BBGA (FCBGA) supplier device package 1152-FBGA (35×35) with surface-mount mounting type for high-density PCB integration.
• Power  Specified voltage supply range of 820 mV to 880 mV for the device core supply domain.
• Temperature and Grade  Extended grade with an operating temperature range of 0 °C to 100 °C to meet thermal requirements of many commercial and enterprise applications.
• Environmental Compliance  RoHS compliant, supporting regulatory requirements for lead-free assembly.

Typical Applications

• High‑density digital processing  Implement complex signal processing, custom compute blocks, and parallel processing engines using the device’s large logic element count and on-chip RAM.
• Memory‑intensive functions  Use the extensive embedded RAM for packet buffering, deep FIFOs, and other on-chip storage needs that reduce external memory dependency.
• Multi‑interface systems  Leverage 392 I/Os to connect to a variety of parallel and serial interfaces for system control, data acquisition, and peripheral aggregation.

Unique Advantages

• High logic capacity: 612,000 logic elements enable implementation of large, complex designs without immediate partitioning across multiple devices.
• Significant on‑chip memory: Over 51 million RAM bits reduce the need for external memory and simplify board-level routing and BOM.
• Rich I/O availability: 392 I/Os provide flexibility for wide data paths, parallel interfaces, and multiple peripheral connections.
• Compact, board‑friendly package: 1152-BBGA (35×35 FCBGA) supports dense PCB layouts while maintaining a surface-mount form factor.
• Tightly defined core supply: A defined voltage supply range (820–880 mV) aids power delivery planning and voltage-domain design.
• Extended operating range: 0 °C to 100 °C operation and extended grade designation align with many commercial and enterprise deployment requirements.

Why Choose 1SG065HH2F35E2LG?

The 1SG065HH2F35E2LG positions itself as a high-capacity, memory-rich FPGA solution for designs that require substantial programmable logic, large on-chip RAM, and a wide set of I/O. Its combination of 612,000 logic elements and 51,380,224 RAM bits supports consolidation of complex functions onto a single device, simplifying system architecture.

This device is well suited for engineering teams and system designers targeting memory‑intensive digital applications, high‑density processing, and systems that benefit from reduced external memory and high I/O counts. The defined power and temperature specifications provide clear parameters for system-level integration and long-term deployment planning.

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