1SG065HH1F35I2LG
| Part Description |
Stratix® 10 GX Field Programmable Gate Array (FPGA) IC 392 51380224 612000 1152-BBGA, FCBGA |
|---|---|
| Quantity | 377 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 392 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 76500 | Number of Logic Elements/Cells | 612000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 51380224 |
Overview of 1SG065HH1F35I2LG – Stratix® 10 GX Field Programmable Gate Array (FPGA), 1152‑BBGA (35×35)
The 1SG065HH1F35I2LG is a Stratix® 10 GX Field Programmable Gate Array (FPGA) IC packaged in a 1152‑BBGA FCBGA. It provides a large on‑chip logic and memory resource set suitable for industrial applications that require configurable hardware capacity within a compact, surface‑mount package.
Designed for industrial‑grade environments, the device combines high logic element count and substantial on‑chip RAM to support complex, customizable digital designs while operating across a wide industrial temperature range.
Key Features
- Core Capacity — 612,000 logic elements available for implementation of custom digital logic and state machines.
- On‑chip Memory — 51,380,224 total RAM bits to support buffering, lookup tables, and embedded processing memory needs.
- I/O Density — 392 I/O pins to interface with peripherals, sensors, and system buses.
- Power — Supported supply voltage range of 820 mV to 880 mV for core operation.
- Package and Mounting — 1152‑BBGA (supplier package: 1152‑FBGA, 35×35); surface‑mount package for PCB assembly.
- Temperature and Grade — Industrial grade with an operating temperature range of −40°C to 100°C.
- Environmental Compliance — RoHS compliant.
Unique Advantages
- Large logic capacity: 612,000 logic elements provide headroom for complex, parallelized designs and programmable hardware acceleration.
- Substantial embedded memory: Over 51 million RAM bits help reduce external memory dependence for many buffer and caching functions.
- High I/O count: 392 I/O pins enable broad connectivity options without additional interface components.
- Industrial robustness: Industrial grade operation from −40°C to 100°C supports deployment in temperature‑challenging environments.
- Compact, manufacturable package: 1152‑BBGA surface‑mount footprint (35×35) simplifies board integration while maintaining high pin density.
- Regulatory alignment: RoHS compliance supports environmentally conscious manufacturing and supply chain requirements.
Why Choose 1SG065HH1F35I2LG?
The 1SG065HH1F35I2LG delivers a combination of extensive logic resources, large on‑chip RAM, and a high I/O count within an industrial‑grade, surface‑mount BBGA package. These specifications make it suitable for designs that require significant programmable logic capacity and memory while maintaining board‑level density and temperature resilience.
Customers seeking a highly capable FPGA for industrial applications will find this device appropriate for scalable, configurable designs where on‑chip resources and RoHS compliance are important selection criteria.
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