1SG065HH1F35E2VG

The 1SG065HH1F35E2VG is a Stratix® 10 GX Field Programmable Gate Array (FPGA) in a 1152-BBGA FCBGA package, designed for large, logic- and memory-intensive designs. It combines 612,000 logic elements, 51,380,224 bits of on-chip RAM and 392 I/O to support complex digital systems that require extensive integration of logic, memory and I/O resources.

This device is supplied in a surface-mount 1152-FBGA (35×35) package, is RoHS compliant and is designated as Extended grade with an operating temperature range of 0 °C to 100 °C and a voltage supply range of 770 mV to 970 mV.

Key Features

• Core Logic – 612,000 logic elements to implement large-scale digital designs and complex logic functions.
• On‑Chip Memory – 51,380,224 total RAM bits for embedded data buffering, state storage and high-capacity memory needs.
• I/O Density – 392 I/O pins providing extensive external connectivity for peripherals, interfaces and board-level integration.
• Package & Mounting – 1152-BBGA (FCBGA) / supplier package 1152-FBGA (35×35) in a surface-mount form factor for high-density PCB designs.
• Power – Supported voltage supply range from 770 mV to 970 mV to match system power rails and power-management schemes.
• Thermal & Grade – Extended-grade device with an operating temperature range of 0 °C to 100 °C suitable for controlled-environment applications.
• Compliance – RoHS compliant for environmental and manufacturing compatibility.

Typical Applications

• Complex digital systems – Implement large-scale logic networks using 612,000 logic elements and extensive on-chip RAM to consolidate functionality on a single device.
• High‑I/O platforms – Support board designs requiring dense external connectivity with 392 available I/O pins for interfaces and peripherals.
• Memory-intensive processing – Use 51,380,224 bits of on-chip RAM for buffering, caching and data-path applications that need substantial on-chip storage.

Unique Advantages

• High integration density: 612,000 logic elements and over 51 million RAM bits enable consolidation of multiple functions into a single FPGA, reducing part count.
• Extensive I/O capability: 392 I/O pins provide flexibility for complex interfacing and multiple peripheral connections without external multiplexing.
• Surface-mount FBGA package: 1152-FBGA (35×35) packaging supports compact, high-density PCB layouts while maintaining robust electrical connections.
• Controlled-environment readiness: Extended grade with 0 °C to 100 °C operating range and RoHS compliance for regulated manufacturing and deployment.
• Defined supply range: 770 mV to 970 mV specification allows designers to align FPGA power requirements with system power architectures.

Why Choose 1SG065HH1F35E2VG?

The 1SG065HH1F35E2VG Stratix® 10 GX FPGA offers a combination of large logic capacity, substantial on-chip memory and high I/O density in a compact 1152-BBGA FCBGA package. Its Extended grade and defined operating and supply ranges make it appropriate for designs that require predictable thermal and power characteristics within a controlled operating environment.

This device is suited for engineers building complex, integrated digital systems who need significant logic and memory resources on a single FPGA. The combination of scalability, package density and RoHS compliance supports streamlined BOMs and manufacturability for sustained product lifecycles.

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