1SG040HH3F35I3VG

The 1SG040HH3F35I3VG is a Stratix® 10 GX Field Programmable Gate Array (FPGA) IC from Intel. It provides a high-density, reconfigurable logic platform with substantial on-chip memory and a large complement of I/O suitable for complex digital designs.

Designed for industrial-grade deployments, this device combines 378,000 logic elements, 31,457,280 total RAM bits and 374 I/O pins in a 1152-BBGA (35×35 FCBGA) package, delivering the integration and environmental tolerance required for demanding applications.

Key Features

• Core Logic Capacity — 378,000 logic elements provide a large programmable fabric for implementing complex digital functions and parallel processing pipelines.
• Logic Block Count — 47,250 logic blocks available for partitioning designs and mapping large-scale logic structures.
• On-Chip Memory — 31,457,280 total RAM bits offer substantial embedded memory for buffering, state storage and data-intensive processing.
• I/O Resources — 374 I/O pins support dense external connectivity and interface variety for peripherals and high-pin-count systems.
• Package — 1152-BBGA (FCBGA, 35×35) package provides a high-density footprint for space-constrained board designs requiring many I/Os.
• Power — Operates across a core voltage range of 770 mV to 970 mV to match system power-rail designs.
• Operating Temperature — Industrial temperature rating from −40 °C to 100 °C for use in temperature-challenging environments.
• Mounting — Surface-mount device suitable for modern PCB assembly processes.
• RoHS Compliance — Environmentally compliant with RoHS requirements.

Typical Applications

• Industrial Control and Automation — Industrial temperature rating and high logic capacity enable control, sequencing and protocol handling in factory and process automation equipment.
• High‑Density Custom Processing — Large logic and memory resources make this device suitable for custom signal processing, data-path acceleration and compute offload implementations.
• I/O-Intensive Systems — With 374 I/O pins, it supports systems requiring extensive external interfacing such as sensor arrays, communication front ends and complex peripheral networks.
• Prototyping and System Integration — Reconfigurable logic and abundant resources support hardware prototyping and integration of multiple functions on a single device.

Unique Advantages

• High logic density: 378,000 logic elements allow implementation of large-scale designs without immediate partitioning across multiple devices.
• Substantial on-chip memory: Over 31 million RAM bits provide local storage for buffering and state machines, reducing external memory dependence.
• Extensive external connectivity: 374 I/O pins enable broad interfacing options and simplify board-level routing for multi-peripheral systems.
• Industrial temperature range: −40 °C to 100 °C rating supports deployment in harsh or temperature-variable environments.
• Compact, high-density package: 1152-BBGA (35×35 FCBGA) delivers many signals in a compact footprint for space-constrained designs.
• Low-voltage core operation: 770 mV to 970 mV supply range aligns with modern power-rail architectures for efficient system integration.

Why Choose 1SG040HH3F35I3VG?

The 1SG040HH3F35I3VG positions itself as a high-capacity, industrial-grade Stratix® 10 GX FPGA suitable for designs that demand a combination of large logic resources, significant on-chip memory and extensive I/O within a compact package. Its specification set supports integration of complex, I/O-heavy functions into a single reconfigurable device.

This device is well suited to engineering teams and procurement groups targeting scalable, robust hardware platforms for industrial applications, custom processing tasks and systems that benefit from reprogrammable logic and high integration density.

Request a quote or submit an inquiry to receive pricing and availability information for 1SG040HH3F35I3VG.