1SG040HH3F35E3XG

The 1SG040HH3F35E3XG is an Intel Stratix® 10 GX Field Programmable Gate Array designed for complex programmable logic applications. It integrates a large logic fabric and substantial on‑chip memory to address designs that require significant combinational and sequential logic plus embedded RAM.

With a broad I/O count and a compact BGA/FBGA package, this device is suited for board‑level integration where high logic capacity, on‑chip memory, and controlled supply voltage operation are required.

Key Features

• Core logic capacity — 378,000 logic elements provide extensive programmable logic resources for complex digital designs.
• Embedded memory — 31,457,280 total RAM bits for on‑chip buffering, state machines, and memory‑intensive functions.
• I/O resources — 374 device I/Os to support high channel count interfaces and board‑level connectivity.
• Power domain — Core voltage supply range of 820 mV to 880 mV for defined power budgeting and regulator selection.
• Package & mounting — Available in 1152‑BBGA FCBGA and supplier device package 1152‑FBGA (35×35) for surface‑mount assembly.
• Operating range — Extended grade operation from 0 °C to 100 °C for deployment in environments within this temperature window.
• Regulatory status — RoHS compliant.

Typical Applications

• High‑density digital logic — Implement large, custom logic functions that require hundreds of thousands of logic elements and significant on‑chip RAM.
• Memory‑intensive processing — Use the device's 31,457,280 RAM bits for buffering, packet staging, or other on‑chip data storage needs.
• Multi‑channel I/O systems — Leverage 374 I/Os for designs with many parallel interfaces, multiplexed signals, or board‑level sensor/actuator connectivity.
• Surface‑mount board integration — Deploy the 1152‑FBGA/BBGA package in compact, high‑density PCBs requiring a surface‑mount FPGA solution.

Unique Advantages

• Large programmable fabric: 378,000 logic elements give designers room to implement complex algorithms and large stateful systems on a single device.
• Substantial on‑chip RAM: 31,457,280 total RAM bits reduce external memory dependence and simplify board design for data‑heavy functions.
• Extensive I/O count: 374 I/Os support complex connectivity and reduce the need for additional I/O expanders.
• Compact high‑pin package: 1152‑FBGA (35×35) / 1152‑BBGA packaging enables high interconnect density in surface‑mount form factors.
• Defined core voltage: 820 mV–880 mV supply range provides clear parameters for power supply design.
• Extended temperature grade: 0 °C–100 °C operation aligns with applications that require a wider commercial temperature window.

Why Choose 1SG040HH3F35E3XG?

The 1SG040HH3F35E3XG combines a large logic element count with significant on‑chip RAM and a high I/O complement in a compact surface‑mount package. It is positioned for designs that demand substantial programmable resources while maintaining a defined power and thermal envelope.

This device is suited for teams and projects requiring scalable logic capacity and embedded memory within an extended temperature range and surface‑mount form factor, offering a straightforward foundation for complex programmable designs.

Request a quote to check pricing and availability for 1SG040HH3F35E3XG and to discuss lead time and ordering details.