1SG040HH3F35E1VG

The 1SG040HH3F35E1VG is a Stratix® 10 GX field programmable gate array (FPGA) IC from Intel. It delivers high logic capacity and on-chip memory in a compact FCBGA package for demanding board-level designs.

Key device characteristics include 378,000 logic elements, 31,457,280 total RAM bits, 374 general-purpose I/O pins, a 1152‑BBGA (1152‑FBGA, 35×35) package, extended-grade qualification, an operating range of 0 °C to 100 °C, and a core voltage supply range of 770 mV to 970 mV.

Key Features

• Core Logic 378,000 logic elements provide significant programmable fabric capacity for complex logic integration and custom processing pipelines.
• On‑Chip Memory 31,457,280 total RAM bits for buffering, packet memory, and intermediate storage to support data‑intensive logic functions.
• I/O Density 374 general-purpose I/O pins to support extensive external interfacing and parallel connectivity on a single device.
• Package 1152‑BBGA, FCBGA assembly with supplier device package listed as 1152‑FBGA (35×35) for high pin count in a board‑level BGA form factor.
• Power Core voltage supply range from 770 mV to 970 mV to match system power architectures that target low‑voltage FPGA operation.
• Temperature & Grade Extended grade device rated for operation from 0 °C to 100 °C and RoHS compliant for environmental compatibility.
• Mounting Surface mount package suitable for standard PCB assembly processes.

Unique Advantages

• High logic capacity: 378,000 logic elements enable dense implementation of complex algorithms and multiple functions on a single device.
• Large on‑chip memory: 31,457,280 RAM bits support buffering and dataflow needs without relying solely on external memory.
• Extensive I/O: 374 I/O pins provide flexibility for broad interfacing requirements, reducing the need for external multiplexing.
• Compact high‑pin package: 1152‑BBGA (1152‑FBGA, 35×35) delivers high connectivity in a manageable board footprint.
• Extended operating range: Rated for 0 °C to 100 °C and supplied in an extended grade package for applications requiring this temperature window.
• Low‑voltage core operation: 770 mV to 970 mV supply range supports designs targeting modern low‑voltage power domains.

Why Choose 1SG040HH3F35E1VG?

The 1SG040HH3F35E1VG combines substantial programmable logic and on‑chip memory with a high I/O count in a 1152‑BBGA FCBGA package, making it suitable for board designs that require a single, high‑capacity FPGA device. Its extended grade rating and defined operating and power ranges provide clear integration parameters for system designers.

As an Intel Stratix® 10 GX device, it is intended for customers who need measurable logic and memory resources along with high pin count connectivity and controlled thermal and power specifications.

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