1SG040HH2F35E2VG

The 1SG040HH2F35E2VG is a Stratix® 10 GX FPGA from Intel, provided as a surface-mount FCBGA device. It delivers a large logic capacity and substantial on-chip RAM in a 1152-ball BGA package suitable for compact board-level integration.

Targeted at designs that require extensive programmable logic, significant embedded memory, and a high I/O count, this device supports applications within an operating temperature range of 0 °C to 100 °C and a core voltage supply range of 770 mV to 970 mV.

Key Features

• Core Logic Capacity — 378,000 logic elements for implementing extensive custom logic and complex algorithms on-chip.
• On-Chip Memory — 31,457,280 total RAM bits to support buffering, large state machines, and data-path storage without immediate reliance on external memory.
• I/O Resources — 374 I/O pins to interface with multiple peripherals and external subsystems.
• Power Supply Range — Core voltage supply specified from 770 mV to 970 mV to match system power design requirements.
• Package and Mounting — 1152-BBGA, FCBGA package (supplier device package: 1152-FBGA (35x35)) in a surface-mount format for high-density board designs.
• Temperature and Grade — Extended grade with an operating temperature range of 0 °C to 100 °C for deployment within that thermal window.
• Environmental Compliance — RoHS compliant materials.

Typical Applications

• Custom Compute Acceleration — Use the 378,000 logic elements and 31,457,280 RAM bits to implement hardware-accelerated datapaths and application-specific processing blocks.
• Multi-Channel I/O Management — 374 I/Os enable control and aggregation of multiple interfaces, sensors, or peripheral channels in a single device.
• Compact System Integration — The 1152-BBGA package supports high pin density in a compact footprint for space-constrained boards.

Unique Advantages

• Large on-chip logic integration: 378,000 logic elements allow consolidation of complex functions onto one FPGA, reducing external component count.
• Substantial embedded memory: 31,457,280 RAM bits provide significant internal buffering and storage capacity for data-intensive designs.
• High connectivity: 374 I/Os offer flexible interfacing options for multi-channel and mixed-signal systems.
• Board-level density: 1152-ball BGA (35×35) surface-mount package enables high pin count in a compact package suitable for dense PCB layouts.
• Specified operational limits: Extended grade operation from 0 °C to 100 °C and a defined core voltage range of 770 mV to 970 mV simplify thermal and power planning.
• Regulatory compliance: RoHS compliance for material and environmental considerations.

Why Choose 1SG040HH2F35E2VG?

The 1SG040HH2F35E2VG provides a high-capacity Stratix® 10 GX FPGA option for engineers who need substantial logic resources and embedded RAM in a single, surface-mount package. With 378,000 logic elements, over 31 million RAM bits, and 374 I/Os, it is suited to consolidating complex digital functions and multi-channel interfaces on compact PCBs.

Manufactured by Intel and offered in an extended temperature grade with RoHS compliance, this device is appropriate for designs that demand large on-chip resources and clearly defined operating voltage and temperature ranges.

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