1SG040HH1F35I2VG

The 1SG040HH1F35I2VG is a Stratix® 10 GX field programmable gate array (FPGA) IC from Intel, configured in a 1152-BBGA FCBGA package. It provides a large programmable fabric combined with substantial on-chip RAM and a high I/O count to support complex digital designs.

With 378,000 logic elements, 31,457,280 bits of on-chip RAM and 374 I/Os, this device is suited to applications that require dense logic implementation, significant embedded memory, and broad interfacing capability while operating across an industrial temperature range.

Key Features

• Logic Capacity — 378,000 logic elements for implementing large, complex logic functions and parallel processing pipelines.
• Embedded Memory — 31,457,280 total RAM bits to support on-chip buffering, state machines, and data flow storage.
• I/O Resources — 374 general-purpose I/Os to accommodate multiple high-pin-count interfaces and external peripherals.
• Power Supply — Operates from a 770 mV to 970 mV supply range, supporting low-voltage system architectures.
• Package & Mounting — 1152-BBGA, FCBGA package (supplier package: 1152-FBGA 35×35) designed for surface-mount assembly.
• Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
• Compliance — RoHS compliant.

Typical Applications

• High-density digital processing — Use the 378,000 logic elements and large embedded RAM to implement wide datapaths and multi-stage processing pipelines.
• Multi-interface bridging — Leverage 374 I/Os to connect numerous external devices, sensors, or communication PHYs in a single programmable device.
• On-board buffering and packet handling — The 31,457,280-bit RAM supports substantial on-chip buffering for packet processing, queuing, and temporary storage.

Unique Advantages

• High logic density: 378,000 logic elements enable consolidation of complex functions into a single FPGA, reducing system BOM and board area.
• Large embedded memory: Over 31 million bits of RAM provide on-chip capacity for buffering, look-up tables, and state storage, minimizing external memory dependence.
• Extensive I/O count: 374 I/Os allow flexible interfacing to multiple peripherals and high-pin-count connectivity without external multiplexing.
• Industrial operating range: −40 °C to 100 °C rating supports deployment in temperature-challenging environments typical of industrial applications.
• Surface-mount BBGA packaging: 1152-BBGA (35×35) package balances pin density with a standard surface-mount footprint for compact system designs.
• Low-voltage core operation: 770 mV–970 mV supply range aligns with low-voltage system designs and modern power-efficient architectures.

Why Choose 1SG040HH1F35I2VG?

The 1SG040HH1F35I2VG positions itself as a scalable, high-capacity FPGA solution for designs demanding large programmable logic blocks, significant on-chip memory, and a wide complement of I/Os. Its industrial temperature rating and surface-mount BBGA packaging make it suitable for compact, robust systems where space and environmental resilience matter.

Engineers specifying this Intel Stratix® 10 GX device benefit from a combination of dense logic resources, substantial embedded RAM, and broad connectivity — a configuration that supports consolidation of complex subsystems onto a single FPGA for reduced board complexity and long-term design flexibility.

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